NeXLev® Parallel Board-to-Board Connectors

Amphenol TCS NeXLev® product line features High-Density Parallel Board-to-Board Connectors capable of handling data rates up to 12.5Gbps. Developed to meet the increasing bandwidth requirements in mezzanine applications, NeXLev enables design engineers to relocate high pin count devices onto a mezzanine or module card to simplify board routing and optimize system performance.

Results: 34
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Amphenol TCS Board to Board & Mezzanine Connectors 300P NeXLev Recept Solder Balls
Datasheet
20In Stock
Min.: 20
Mult.: 20

Receptacles 300 Position 1.15 mm (0.045 in) 30 Row BGA Vertical 18 mm, 20 mm, 22 mm, 25 mm 1 A 600 V 12.5 Gbps - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev Tray

Amphenol TCS Board to Board & Mezzanine Connectors 300P NeXLev Plug Solder Balls
Datasheet
20In Stock
Min.: 20
Mult.: 20

Plugs 300 Position 1.15 mm (0.045 in) 30 Row BGA Vertical 12 mm, 15 mm, 20 mm, 25 mm, 28 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev Tray

Amphenol TCS Board to Board & Mezzanine Connectors 200P NeXLev Recept 380 Solder Balls
Datasheet
24In Stock
Min.: 24
Mult.: 24

Receptacles 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 18 mm, 20 mm, 22 mm25 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev
Amphenol TCS Board to Board & Mezzanine Connectors 200P NeXLev Recept Solder Balls
Datasheet
Non-Stocked
Min.: 24
Mult.: 24

Receptacles 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 10 mm, 12 mm, 14 mm, 17 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev

Amphenol TCS Board to Board & Mezzanine Connectors 200P NeXLev Recept 380 Solder Balls
Datasheet
Non-Stocked Lead-Time 26 Weeks
Min.: 24
Mult.: 24

Receptacles 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 13 mm, 15 mm, 17 mm, 20 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev Tray
Amphenol TCS Board to Board & Mezzanine Connectors 200P NeXLev Recept Solder Balls
Datasheet
Non-Stocked
Min.: 24
Mult.: 24

Receptacles 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 13 mm, 15 mm, 17 mm, 20 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev

Amphenol TCS Board to Board & Mezzanine Connectors 200P NeXLev Recept Solder Balls
Datasheet
Non-Stocked
Min.: 24
Mult.: 24

Receptacles 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 18 mm, 20 mm, 22 mm, 25 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev Tray

Amphenol TCS Board to Board & Mezzanine Connectors 200P NeXLev Recept 380 Solder Balls
Datasheet
Non-Stocked
Min.: 24
Mult.: 24

Receptacles 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 23 mm, 25 mm, 27 mm, 30 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev
Amphenol TCS Board to Board & Mezzanine Connectors 200P NeXLev Recept Solder Balls
Datasheet
Non-Stocked
Min.: 24
Mult.: 24

Receptacles 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 23 mm, 25 mm, 27 mm, 30 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev
Amphenol TCS Board to Board & Mezzanine Connectors 200P NeXLev Recept 380 Solder Balls
Datasheet
Non-Stocked
Min.: 24
Mult.: 24

Receptacles 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 26 mm, 28 mm, 30 mm, 33 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev Bulk
Amphenol TCS Board to Board & Mezzanine Connectors 200P NeXLev Recept Solder Balls
Datasheet
Non-Stocked
Min.: 24
Mult.: 24

Receptacles 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 26 mm, 28 mm, 30 mm, 33 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev
Amphenol TCS Board to Board & Mezzanine Connectors 300P NeXLev Recept 570 Solder Balls
Datasheet
Non-Stocked
Min.: 20
Mult.: 20

Receptacles 300 Position 1.15 mm (0.045 in) 30 Row BGA Vertical 10 mm, 12 mm, 14 mm, 17 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev Tray
Amphenol TCS Board to Board & Mezzanine Connectors 300P NeXLev Recept Solder Balls
Datasheet
Non-Stocked
Min.: 20
Mult.: 20

Receptacles 300 Position 1.15 mm (0.045 in) 30 Row BGA Vertical 10 mm, 12 mm, 14 mm, 17 mm 1 A 600 V 12.5 Gbps - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev Tray
Amphenol TCS Board to Board & Mezzanine Connectors 300P NeXLev Recept 570 Solder Balls
Datasheet
Non-Stocked
Min.: 40
Mult.: 20

Receptacles 300 Position 1.15 mm (0.045 in) 30 Row BGA Vertical 13 mm, 15 mm, 17 mm, 20 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev
Amphenol TCS Board to Board & Mezzanine Connectors 300P NeXLev Recept Solder Balls
Datasheet
Non-Stocked
Min.: 20
Mult.: 20

Receptacles 300 Position 1.15 mm (0.045 in) 30 Row BGA Vertical 13 mm, 15 mm, 17 mm, 20 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev
Amphenol TCS Board to Board & Mezzanine Connectors 300P NeXLev Recept 570 Solder Balls
Datasheet
Non-Stocked
Min.: 20
Mult.: 20

Receptacles 300 Position 1.15 mm (0.045 in) 30 Row BGA Vertical 18 mm, 20 mm, 22 mm, 25 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev
Amphenol TCS Board to Board & Mezzanine Connectors 300P NeXLev Recept 570 Solder Balls
Datasheet
Non-Stocked
Min.: 20
Mult.: 20

Receptacles 300 Position 1.15 mm (0.045 in) 30 Row BGA Vertical 23 mm, 25 mm, 27 mm, 30 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev
Amphenol TCS Board to Board & Mezzanine Connectors 300P NeXLev Recept Solder Balls
Datasheet
Non-Stocked
Min.: 20
Mult.: 20

Receptacles 300 Position 1.15 mm (0.045 in) 30 Row BGA Vertical 23 mm, 25 mm, 27 mm, 30 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev
Amphenol TCS Board to Board & Mezzanine Connectors 300P NeXLev Recept 570 Solder Balls
Datasheet
Non-Stocked
Min.: 20
Mult.: 20

Receptacles 300 Position 1.15 mm (0.045 in) 30 Row BGA Vertical 26 mm, 28 mm, 30 mm, 33 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev Tray
Amphenol TCS Board to Board & Mezzanine Connectors 300P NeXLev Recept Solder Balls
Datasheet
Non-Stocked
Min.: 20
Mult.: 20

Receptacles 300 Position 1.15 mm (0.045 in) BGA Vertical 26 mm, 28 mm, 30 mm, 33 mm 1 A 600 V 12.5 Gbps - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev Tray
Amphenol TCS Board to Board & Mezzanine Connectors 200P NeXLev Plug 380 Solder Balls
Datasheet
Non-Stocked
Min.: 96
Mult.: 24

Plugs 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 10 mm, 13 mm, 18 mm, 23 mm, 26 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev Tray
Amphenol TCS Board to Board & Mezzanine Connectors 200P NeXLev Plug Solder Balls
Datasheet
Non-Stocked
Min.: 24
Mult.: 24

Plugs 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 10 mm, 13 mm, 18 mm, 23 mm, 26 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev

Amphenol TCS Board to Board & Mezzanine Connectors 200P NeXLev Plug 380 Solder Balls
Datasheet
Non-Stocked
Min.: 24
Mult.: 24

Plugs 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 12 mm, 15 mm, 20 mm, 25 mm, 28 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev

Amphenol TCS Board to Board & Mezzanine Connectors 200P NeXLev Plug Solder Balls
Datasheet
Non-Stocked Lead-Time 18 Weeks
Min.: 24
Mult.: 24

Plugs 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 12 mm, 15 mm, 20 mm, 25 mm, 28 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev Tray
Amphenol TCS Board to Board & Mezzanine Connectors 200P NeXLev Plug 380 Solder Balls
Datasheet
Non-Stocked
Min.: 24
Mult.: 24

Plugs 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 14 mm, 17 mm, 22 mm, 27 mm, 30 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev