VIA Technologies SOM-5000 Evaluation Kit
VIA Technologies SOM-5000 Starter Kit accelerates the development of advanced edge AI systems and devices with the VIA SOM-5000 SMARC 2.11 module. This kit is powered by a MediaTek Genio 700 Octa-core processor, MediaTek Deep Learning Accelerator (MDLA) 3.0, and Cadence® Tensilica® Vision P6 NPU. The SOM-5000 module supports H.265 and H.264 video decoding up to 4K at 75fps and video encoding up to 4K at 30fps. This kit includes the SOM-5000 module, the SOMDB7 carrier board, the heatsink, the power cable, and the debug console cable. This highly integrated low-power platform delivers blistering AI, graphics, video, and computing performance required for the most demanding industrial, commercial, and consumer use cases.
Features
- High-performance MediaTek Genio 700 Octa-Core System on a Chip (SoC)
- Powerful and efficient MediaTek Deep Learning Accelerator (MDLA) 3.0 and Cadence® Tensilica® Vision P6 NPU supporting up to 4 TOPS
- 4K hardware-accelerated H.265/H.264 video processing
- Dual display and dual MIPI CSI-2 camera support
- Optional 4G LTE mobile broadband support with onboard M.2 and SIM card slots
- Supports Android 13, Yocto 4.0, and Debian 12 OS for flexible Edge AI deployments
Applications
- Smart fitness
- Portable handheld devices
- Electric vehicle charging
- Building security
Specifications
- 8GB LPDDR4X SDRAM (2 x LPDDR4X) system memory
- 16GB eMMC Flash memory storage
- Integrated Gigabit Ethernet transceiver
- MediaTek MT6365 PMIC/audio Codec
- Integrated HDMI 2.0 transmitter
- 0% to 95% (relative humidity and non-condensing) operating humidity range
- CE, FCC, and UKCA compliance
Kit Contents
- SOM-5000 module
- SOMDB7 carrier board
- Audio cable
- Heatsink
- Power cable
- Debug console cable
Block Diagram
Board Overview
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