TS391 No-Clean Solder Paste

Chip Quik TS391 No-Clean Solder Paste is a dispense grade, synthetic paste with no refrigeration required to maintain shelf life. The no-clean solder paste provides excellent wetting compatibility on most board finishes, exhibiting a wide process window with low voiding and long stencil life. Chip Quik TS391 solder paste leaves a clear residue and supports printing speeds up to 125mm/sec. This solder paste is available with three different alloy compositions, each with different melting points, in 15g, 35g, 50g, 250g, and 500g packaging. The RoHS II and REACH compliant paste features a T4 mesh size, 20µm to 38µm range, and a ROL0 flux classification.

Resultat: 15
Välj Bild Artikelnummer Tillverk: Beskrivning Datablad Tillgänglighet Prissättning: (SEK) Filtrera resultaten i tabellen efter enhetspris baserat på din kvantitet. Antal RoHS Produkt Typ Legering Förpackningstyp
Chip Quik Lod Paste No-Clean 500g Sn63/Pb37 T4
12Förväntad 2026-09-23
Min.: 1
Multipla: 1
Solder Paste Tin/Lead, No Clean, Thermally Stable Sn63/Pb37 Cartridge
Chip Quik Lod Paste No-Clean 15g Sn63/Pb37 T4 404På lager
Min.: 1
Multipla: 1
Solder Paste Tin/Lead, No Clean, Thermally Stable Sn63/Pb37 Syringe
Chip Quik Lod Paste No-Clean 35g Sn63/Pb37 T4 418På lager
Min.: 1
Multipla: 1
Solder Paste Tin/Lead, No Clean, Thermally Stable Sn63/Pb37 Syringe
Chip Quik Lod Paste No-Clean 250g Sn63/Pb37 T4 159På lager
Min.: 1
Multipla: 1
Solder Paste Tin/Lead, No Clean, Thermally Stable Sn63/Pb37 Jar
Chip Quik Lod Paste No-Clean 50g Sn63/Pb37 T4 183På lager
458På beställningen
Min.: 1
Multipla: 1
Solder Paste Tin/Lead, No Clean, Thermally Stable Sn63/Pb37 Jar
Chip Quik Lod Paste NoClean 15g Sn42/Bi57.6/Ag0.4 T4 331På lager
Min.: 1
Multipla: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn42/Bi57.6/Ag0.4 Syringe
Chip Quik Lod Paste NoClean 35g Sn42/Bi57.6/Ag0.4 T4 150På lager
Min.: 1
Multipla: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn42/Bi57.6/Ag0.4 Syringe
Chip Quik Lod Paste NoClean 250g Sn42/Bi57.6/Ag0.4 T4 65På lager
Min.: 1
Multipla: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn42/Bi57.6/Ag0.4 Jar
Chip Quik Lod Paste No-Clean 50g Sn42/Bi57.6/Ag0.4 T4 81På lager
196Förväntad 2026-08-10
Min.: 1
Multipla: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn42/Bi57.6/Ag0.4 Jar
Chip Quik Lod Paste NoClean 15g T4 Sn96.5/Ag3.0/Cu0.5 103På lager
262Förväntad 2026-09-09
Min.: 1
Multipla: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn96.5/Ag03/Cu0.5 Syringe
Chip Quik Lod Paste NoCln 250g T4 Sn96.5/Ag3.0/Cu0.5 56På lager
241På beställningen
Min.: 1
Multipla: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn96.5/Ag03/Cu0.5 Jar
Chip Quik Lod Paste NoClean 50g T4 Sn96.5/Ag3.0/Cu0.5 134På lager
360Förväntad 2026-08-26
Min.: 1
Multipla: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn96.5/Ag03/Cu0.5 Jar
Chip Quik Lod Paste NoClean 35g T4 Sn96.5/Ag3.0/Cu0.5 45På lager
135Förväntad 2026-08-10
Min.: 1
Multipla: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn96.5/Ag03/Cu0.5 Syringe
Chip Quik Lod Paste No-Clean 500g Sn42/Bi57.6/Ag0.4 T4 Ledtid för icke lagerfört 6 Veckor
Min.: 1
Multipla: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn42/Bi57.6/Ag0.4 Cartridge
Chip Quik Lod Paste NoCln 500g T4 Sn96.5/Ag3.0/Cu0.5 N/A
Min.: 1
Multipla: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn96.5/Ag03/Cu0.5 Cartridge