ROHM Semiconductor BST740D08P4A1x4 TRCDRIVE pack™ with Molded Modules

ROHM Semiconductor BST740D08P4A154 and BST740D08P4A164 TRCDRIVE pack™ with 2-in-1 SiC Molded Modules feature 750V rated voltage and are designed to significantly reduce the size of electric vehicle (xEV) inverters. These power-dense modules integrate 4th Generation SiC MOSFETs in a compact package with dimensions of 58.6mm x 52.5mm. The TRCDRIVE pack devices support up to 300kW and utilize a unique terminal configuration that addresses the key challenges of traction inverters regarding miniaturization, higher efficiency, and fewer person-hours. ROHM Semiconductor BST740D08P4A154 and BST740D08P4A164 modules provide ease of use for designers and do not require soldering for the signal terminals.

Features

  • Combination of press-fit pins and molding technology results in smaller design
  • High power density due to higher heat dissipation and lower stray inductance
  • Ease of use, including no soldering for signal terminals
  • Discrete packaging production system for high productivity
  • Designed for automotive traction inverters
  • AQG 324 qualified

Specifications

  • 750VDSS maximum voltage
  • 738A maximum DC current
  • Maximum AC current
    • BST740D08P4A154: 634A
    • BST740D08P4A164: 659A
  • 1.4mΩ maximum RDS(on)
  • Heat sink assembly
    • BST740D08P4A154: TIM: heat dissipation sheet
    • BST740D08P4A164: Ag sinter
  • 58.6mm × 52.5mm dimensions

TRCDRIVE pack

Infographic - ROHM Semiconductor BST740D08P4A1x4 TRCDRIVE pack™ with Molded Modules

Power-Dense Design

Infographic - ROHM Semiconductor BST740D08P4A1x4 TRCDRIVE pack™ with Molded Modules
Publicerad: 2024-06-13 | Uppdaterad: 2024-06-19