Laird Technologies BMI-S-608 Shield Frame
Laird Technologies BMI-S-608 Shield Frame is a one-part shielding solution with a stainless-steel design and without a top-mount cover. This shield frame includes rows of integrated contact spring fingers on each inner sidewall of the four-sided shield. The spring fingers grasp the heat sink housing directly and integrate the heat sink with the PCB’s heat-sensitive components. The shield frame reduces the spacing between adjacent shields and allows easier repairs of components. Additional features include excellent solderability and corrosion performance, <0.10mm typical flatness / coplanarity, and -40°C to +125°C operating temperature range. Laird Technologies BMI-S-608 Shield Frame is used in high-power computing, domain controllers, radio navigation systems, and instrument cluster displays.Features
- Enhanced design freedom involving PCB layout
- Permits reduction in spacing between adjacent shields
- Enables easier repairs of components
- 1μm minimum underlayer nickel
- Superior solderability and corrosion performance
- Alternative to multi-component manufacturer solutions
- Stainless steel X10 CrNi18-8, (EN 1.4310) base materials
- -40°C to +125°C operating temperature range
- 0.2mm material thickness
- <0.10mm typical flatness / coplanarity
Applications
- Automotive/ADAS/AVS
- Infotainment smart boxes
- Radio navigation systems
- Instrument cluster displays
- High power computing
- Central vehicle controllers
- Domain controllers
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Publicerad: 2024-05-31
| Uppdaterad: 2025-06-19
