FTDI Chip FT602 USB 3.0 UVC Bridge IC

FTDI Chip FT602 USB 3.0 IC is a FIFO interface to SuperSpeed (USB 3.1 Gen 1) USB Video Class (UVC) Bridge Chip. The FT602 USB IC offers support for high-definition video content streaming. The FT602 allows imaging systems, which would have previously only been capable of delivering relatively low-resolution material, to gain elevated video quality but still run at 60fps.

The FT602 USB 3.0 IC can be incorporated into existing designs with minimal investment. No custom drivers are required, thereby permitting straightforward plug-and-play implementation.

The FT602 USB IC is capable of providing both USB 3.0 SuperSpeed (5Gbps) and USB 2.0 High Speed (480Mbps) interfacing. This USB Bridge incorporates a 32-bit parallel FIFO interface for data streaming and a UART interface for control path configuration. The FT602 USB IC is offered in a compact, Pb-free, RoHS compliant QFN-76 package.

Features

  • Supports:
    • USB 3.1 GEN 1 SuperSpeed (5Gbps)
    • USB 2.0 High Speed (480Mbps)
    • USB Transfer Control, Bulk, and Interrupt Types
    • UVC version 1.1
    • FT245 and FT600 FIFO modes
    • Up to 4 video input channels on the FIFO bus
    • 2 parallel slave FIFO bus protocols, 245 FIFO and multi-channel FIFO mode, with a data burst rate up to 400MB/s with 32-bit parallel interface
    • Multi-voltage (1.8V, 2.5V, and 3.3V) I/O
  • Built-in 16kB FIFO data buffer RAM
  • Built-in I2C master interface for video device configuration
  • Internal LDO 1.0V regulator
  • Integrated power-on-reset circuit
  • User-programmable USB descriptors
  • Industrial -40⁰C to 85⁰C operating temperature range
  • Compact 9.0x9.0mm QFN-76 package
  • Pb free, RoHS compliant

Applications

  • Machine vision
  • Surveillance and security
  • Home and office automation
  • Medical/industrial imaging devices
  • USB 3.1 instrumentation
  • HD video interface
  • Digital HD cameras
  • Metrology
  • Real-time microscopy

Block Diagram

Block Diagram - FTDI Chip FT602 USB 3.0 UVC Bridge IC

FTDI Chip UMFT602A and UMFT602X Evaluation Modules

FTDI Chip FT602 USB 3.0 UVC Bridge IC

FTDI Chip UMFT602A and UMFT602X Evaluation Modules (EVMs) are designed to facilitate the demonstration, evaluation, and prototyping of the FT602 USB 3.0 UVC Bridge IC. The UMFT602A and UMFT602X EVMs are daughter cards and must be used with a FIFO Master Board. The EVMs feature 32-bit FIFO bus interfaces, which allow them to be used with FPGA (Field-Programmable Gate Array) development platforms, such as those supplied by Xilinx or Altera. The UMFT602A offers an HSMC (High-Speed Mezzanine Card) connector, which is compatible with most Altera FPGA reference design boards. The UMFT602X features an FMC (Field Programmable Mezzanine Card) connector, which is compatible with most Xilinx FPGA reference design boards.

View Details
Datasheet

• USB 3.1 GEN 1 SuperSpeed (5Gbps)
• USB 2.0 High Speed (480Mbps) transfer
• UVC 1.1, Raw YUV422
• Up to 4 video input channels
• I2C bus master interface for video source device configuration
• Supports multi-voltage (1.8V, 2.5V, and 3.3V) I/O
• High-speed connector for 32-bit FIFO bus
     • UMFT602A: HSMC (High-Speed Mezzanine Card)
     • UMFT602X: FMC (Field Programmable Mezzanine Card)
• Multiple power options:
     • VBUS powered
     • External DC powered
     • FIFO BUS powered via FMC/HSMC
• Hardware Reset
• Micro USB 3.0 receptacle

Publicerad: 2017-04-25 | Uppdaterad: 2022-03-11