Chip Quik Black & Pink ESD Foam
Chip Quik Black and Pink ESD Foam is designed for IC leg and pin insertion and protects sensitive electronic components and assemblies during storage and transit. This crosslinked high-density polyethylene, closed-cell foam is rigid yet flexible enough for bracing, blocking, wrapping, and cushioning sensitive electronic devices. The lineup includes pink anti-static, electrostatic dissipative foam in 24" x 18" sheets with a 0.5" thickness and a surface resistance of 1x10^9 to 1x10^12 Ω/square. The black foam is carbon loaded and conductive, available in 12" x 9" x 0.25" sheets with a surface resistance of 1x10^3 to 1x10^5 Ω/square. The pink foam is ideal for larger, more durable pins, while the black foam is suitable for smaller, more fragile pins. Both Chip Quik ESD foam types are lead-insertion grade and RoHS 3 and REACH compliant.Features
- For IC leg and pin insertion
- Can be used for blocking, bracing, cushioning, and wrapping sensitive electronic devices
- Crosslinked high-density polyethylene, rigid, closed-cell foam
- Lead-insertion grade
- RoHS 3 and REACH compliant
Specifications
- Black ESD foam
- Carbon loaded, conductive
- For smaller, more fragile pins
- 12" x 9" x 0.25" dimensions
- 1x10^3 to 1x10^5 Ω/square surface resistance
- -2% / +4% dimensional tolerances
- Pink ESD foam
- Anti-static, electrostatic dissipative
- For larger, more durable pins
- 24" x 18" x 0.5" dimensions
- 1x10^9 to 1x10^12 Ω/square surface resistance
- -2% / +4% dimensional tolerances
Publicerad: 2025-07-21
| Uppdaterad: 2025-07-29
