Advanced Thermal Solutions Heat Sinks for NVIDIA® Jetson Products
Advanced Thermal Solutions Heat Sinks for NVIDIA® Jetson Products are built for the NVIDIA Jetson models widely used in autonomous machines and other embedded and edge applications. These passive (fanless) and active (fan-ready) heat sinks safeguard the component life and performance of the NVIDIA Jetson family, from the high-performance Jetson AGX Orin to the small form factor Jeston Orin Nano series. Each black anodized, aluminum, straight-fin heat sink includes either mounting screws or a steel leaf spring and screws for secure mounting on the PCB. Advanced Thermal Solutions Heat Sinks feature thermal interface material (TIM) that is pre-assembled on the attachment side of the heat sink.
Features
- Designed to fit the Nvidia Jetson family
- Up to 40W cooling capacity (compatible with Orin NX super mode)
- Provided with leaf spring and screws for secure PCB mounting
- Provided with pre-assembled TIM on base
- Recommended through-hole size in PCB is 3.20mm
- 32mm Center to Center (C-C) fan assembly hole pattern (ATS-NVA2-3554-C3-R0)
- Note: fans are not included and should be chosen to match performance needs
Applications
- Robotics
- Edge AI
Leaf Spring Options
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