THERM-A-GAP™ PAD 30 3.2W/m-K Low Force Gap Pads

Parker Chomerics THERM-A-GAP™ PAD 30 Low Force Gap Pads provide 3.2W/m-K thermal conductivity, providing a universal solution for applications that require a moderate thermal performance in electronic device designs. This cost-effective solution is optimized for design flexibility, with several material carrier options and ease of customization for unusual shapes and sizes. The thermally conductive, electrically isolating gap filler pads combine heat transfer with low outgassing and low compression forces to deliver effective heat transfer between electronic devices, heat sinks, or other cooling features. Parker Chomerics THERM-A-GAP PAD 30 Low Force Gap Pads offer 30 Shore 00 hardness and are designed to maintain conformability in gaps due to uneven mating surfaces, rough surface textures, or air gaps. The "A" version features an aluminum foil carrier with pressure-sensitive adhesive (PSA) for permanent attachment.