Utvecklingskort och satser - x86 EVALUATION CARRIER BRD FOR QSEVEN 2.0

Computer-on-Modules - COM JUMPtec COMe mini Active Uni Cooler (w/o HSP)

Computer-on-Modules - COM COM Express Type 6 Basic module based on AMD embedded R-Series R1606G 2-core processor with 2.6 GHz up to 3.5 GHz turbo boost, 1MB L2 Cache and dual channel DDR4 2400MT/s memory interface (formerly Great Horned Owl). Features AMD Radeon Vega integr

Computer-on-Modules - COM COM Express Type 6 Compact module with Intel Celeron 3955U dual core processor with 2.0GHz, 2MB L2 cache, 2133MT/s dual channel DDR4 memory interface

Computer-on-Modules - COM JUMPtec COMe-bKL6 i3-7102E CM238

Computer-on-Modules - COM COM Express Type 6 Compact module based on Intel Core i7-8665UE 4-core processor with 1.7GHz up to 4.4GHz turbo boost, 8MB L2 cache, Intel UHD Graphics 620 and dual channel DDR4 2400 MT/s memory interface (formerly Whiskey Lake).

Datorkablar RS232 console adaptor cable

Computer-on-Modules - COM JUMPtec COMe Eval Carrier2 T6 5mm

Computer-on-Modules - COM SMARC 2.0 module with advanced low-power 14nm NXP i.MX 8M Mini Quad processor. Features 4x ARM Cortex-A53 @1.8GHz and 1x ARM Cortex-M4, 2GB onboard LPDDR4 memory and 16GB onboard eMMC. Commercial temperature range.

Kylflänsar HSP COMe-mAL10 E2 through

Kylflänsar Standard heatspreader for Qseven module conga-QA5* For modules with IHS CPU* With bore hole 2.7mm stand-offs.

Kylflänsar Standard heatspreader for high performance COM-HPC module conga-HPC/cTLU with integrated heatpipe, 13mm height. All standoffs are with 2.7mm bore hole.