Oklassificerat

congatec COM-HPC Size A module based on Intel Processor U300E with 1 P-core 1.1GHz up to 4.3GHz Turbo and 4 E-cores 0.9GHz up to 3.2GHz Turbo 8MB Intel Smart Cache Intel UHD Graphics with 48 EUs Dual channel DDR5 5200 MT/s memory interface Intel c

congatec COM Express Type 6 Compact module based on Intel Core Ultra 7 processor with 6 P-cores, 8 E-cores and 2 Low Power E-cores P-cores 2.0Ghz up to 5.1GHz (turbo) E-Cores 1.5GHz up to 4.4GHz (turbo) Low Power E-cores up to 2.5GHz (turbo) Integra

congatec COM Express Type 6 Compact module based on Intel Core Ultra 7 processor with 2 P-cores, 8 E-cores and 2 Low Power E-cores P-cores 2.0Ghz up to 5.2GHz (turbo) E-Cores 1.7GHz up to 4.2GHz (turbo) Low Power E-cores up to 2.4GHz (turbo) Integra

congatec COM-HPC Client module based on Intel Core 7 Processor 251E with 8P-cores 2.1GHz up to 5.6GHz Turbo and 16 E-cores 1.6GHz up to 4.4 GHz Turbo 36MB Intel Smart Cache Intel UHD Graphics 770 with 32EUs Dual channelDDR5 memory interface Chipset

congatec COM-HPC Client module based on Intel Core 3 Processor 201E with 4P-cores 3.6GHz up to 4.8GHz Turbo 12MB Intel Smart Cache Intel UHD Graphics770 with 24EUs Dual channel DDR5 memory interface Chipset Q670E Intel code name: Bartlett Lake S

congatec SMARC 2.1 module with Intel Core 3 N355 8-core processor with 1.9GHz core frequency up to 3.9GHz (turbo), 16GB 4800MT/s LPDDR5 onboard memory and 64GB eMMC 5.1 onboard flash. Commercial grade temperaturerange from 0 C to 60 C.

congatec SMARC 2.1 module with Intel Atom x7433RE 4-core processor with 1.5GHz core frequency up to 3.4GHz (turbo), 16GB 4800MT/s LPDDR5 onboard memory and 64GB eMMC 5.1 onboard flash. Industrial grade temperaturerange from -40 C to 85 C.

congatec SMARC Module with NXP i.MX 9596 6-core processor. Features 6x ARM Cortex-A55 @ 2 GHz, ARM Cortex-M7, ARM Cortex-M33, eIQ Neutron NPU, 8GB onboard LPDDR5 memory and 64GB onboard eMMC. Commercial grade temperature range from 0 C to 60 C.

congatec Passive cooling solution for SMARC Module conga-SMX95. All standoffs are with 2.7mm bore hole.Variant for SMARC module with Bare Die CPU Package.

congatec Evaluation Carrier Board for COM-HPC Mini modules.