EasyPACK™ TRENCHSTOP™ IGBT7 Modules

Infineon Technologies EasyPACK™ TRENCHSTOP™ IGBT7 Modules are based on micro-pattern trenches technology. This provides reduced losses and offers a high level of controllability. The chip is specially optimized for industrial drive applications. The modules offer lower static losses, higher power density, and softer switching. A significant increase in power density can be obtained by raising the allowed maximum operation temperature up to 175°C in the power module.

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Antal RoHS ECAD-modell Produkt
Konfiguration
Kollektor- Emitterspänning VCEO Max.
Kollektor - Sändarens mättnadsspänning
Kontinuerlig kollektorström vid 25 C
Gate-sändarens läckström
Minsta drifttemperatur
Maximal drifttemperatur
Förpackning
Infineon Technologies IGBT-moduler 950 V 400 A EasyPACK module with TRENCHSTOP IGBT7 and CoolSiC Schottky diode
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23På lager
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IGBT Silicon Modules 1.23 V 200 A - 40 C + 125 C Tray
Infineon Technologies IGBT-moduler 1200 V, 25 A sixpack IGBT module
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2På lager
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Multipla: 1

IGBT Silicon Modules 6-Pack 1.2 kV 1.6 V 25 A 100 nA - 40 C + 175 C Tray
Infineon Technologies IGBT-moduler 1200 V, 35 A sixpack IGBT module
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26På lager
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IGBT Silicon Modules 6-Pack 1.2 kV 1.6 V 35 A 100 nA - 40 C + 175 C Tray
Infineon Technologies IGBT-moduler 1200 V, 50 A sixpack IGBT module
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15På lager
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Multipla: 1

IGBT Silicon Modules 6-Pack 1.2 kV 1.5 V 50 A 100 nA - 40 C + 175 C Tray
Infineon Technologies F3L400R10W3S7FB11BPSA1
Infineon Technologies IGBT-moduler 950 V, 400 A 3-level IGBT module
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1På lager
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SiC IGBT Modules 3-Phase Inverter 950 V 1.4 V 220 A 100 nA - 40 C + 150 C Tray
Infineon Technologies FS3L200R10W3S7FB11BPSA1
Infineon Technologies IGBT-moduler 950 V, 200 A 3-level IGBT module
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9På lager
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Multipla: 1
SiC IGBT Modules 3-Phase Inverter 950 V 1.27 V 70 A 100 nA - 40 C + 150 C Tray