EasyPACK™ CoolSiC™ Trench MOSFET Modules

Infineon Technologies EasyPACK™ CoolSiC™ Trench MOSFET Modules feature PressFIT contact technology and an integrated Negative Temperature Coefficient (NTC) temperature sensor. These modules operate at a 1200V drain-source voltage, feature a low inductive design, low switching losses, and high current density. The EasyPACK™ modules offer rugged mounting due to integrated mounting clamps and are packaged with a CTI >600. Applications include high-frequency switching devices, DC/DC converters, and DC chargers for EVs. With the Easy 2C Series, Infineon enhances high-power designs using SiC G2 technology and advanced .XT features. The .XT technology provides enhanced ruggedness and extended operating temperatures, while the second-generation SiC MOSFET technology offers improved gate oxide reliability and reduced on-resistance.

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Infineon Technologies MOSFET-moduler EasyPACK 2C CoolSiC MOSFET M2 .XT, 3-level module 1200 V, 8 mOhm with NTC temperature sensor and high current PressFIT contact technology
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33På lager
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MOSFET Modules SiC Press Fit
Infineon Technologies MOSFET-moduler EasyPACK 2C CoolSiC MOSFET M2 .XT, 3-level module 1200 V, 8 mOhm with NTC temperature sensor, pre-applied thermal interface material 2.0 and high current PressFIT contact technology
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16På lager
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Multipla: 1

MOSFET Modules SiC Press Fit
Infineon Technologies MOSFET-moduler EasyPACK 1C CoolSiC MOSFET M2 .XT, fourpack module 1200 V, 13 mOhm with NTC temperature sensor and high current PressFIT contact technology
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45På lager
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MOSFET Modules SiC Press Fit
Infineon Technologies MOSFET-moduler EasyPACK 1C CoolSiC MOSFET M2 .XT, fourpack module 1200 V, 13 mOhm with NTC temperature sensor, pre-applied thermal interface material 2.0 and high current PressFIT contact technology
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30På lager
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MOSFET Modules SiC Press Fit
Infineon Technologies MOSFET-moduler EasyPACK module with CoolSiC Trench MOSFET and PressFIT / NTC
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3På lager
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MOSFET Modules SiC Press Fit
Infineon Technologies MOSFET-moduler EasyPACK 2C CoolSiC MOSFET M2 .XT, fourpack module 1200 V, 8 mOhm with NTC temperature sensor and high current PressFIT contact technology
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23På lager
Min.: 1
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MOSFET Modules SiC Press Fit
Infineon Technologies MOSFET-moduler EasyPACK 2C CoolSiC MOSFET M2 .XT, fourpack module 1200 V, 8 mOhm with NTC temperature sensor, pre-applied thermal interface material 2.0 and high current PressFIT contact technology
Datablad
15På lager
18Förväntad 2026-09-11
Min.: 1
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MOSFET Modules SiC Press Fit
Infineon Technologies Åtskilda halvledaremoduler EasyPACK module with CoolSiC Trench MOSFET and High Current Pin / NTC
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10På lager
24På beställningen
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Multipla: 1

Discrete Semiconductor Modules SiC Press Fit
Infineon Technologies MOSFET-moduler EasyPACK module with CoolSiC Trench MOSFET and PressFIT / NTC
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15På lager
Min.: 1
Multipla: 1

MOSFET Modules SiC Press Fit