HD Express® Interconnect System

Amphenol TCS HD Express® Interconnect System is a high-performance, high-density backplane solution designed to meet PCIe Generation 6 mechanical and electrical requirements for 85Ω impedance systems. Engineered with a single-wafer design, this system enables easy system scaling and offers a competitive cost structure. All press-fit pins ensure reliable board terminations, making the Amphenol TCS HD Express Interconnect System ideal for servers, storage, and high-performing applications.

Resultat: 4
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Antal RoHS ECAD-modell Produkt
Antal positioner
Antal rader
Delning
Termineringsstil
Förpackning
Amphenol TCS Höghastighets/modulära kontakter HD Express Backplane 4Pr, 4Pos
Datablad
171Förväntad 2026-05-07
Min.: 1
Multipla: 1

Backplane Connector 32 Position 4 Row 2 mm Press-Fit Tray
Amphenol TCS Höghastighets/modulära kontakter HD Express Backplane 4Pr, 16Pos
Datablad
54Förväntad 2026-05-07
Min.: 1
Multipla: 1

Backplane Connector 128 Position 4 Row 2 mm Press-Fit Tray
Amphenol TCS Höghastighets/modulära kontakter HD Express Daughter Card 4Pr, 4Pos
Datablad
120Förväntad 2026-05-07
Min.: 1
Multipla: 1

Daughter Card Module 32 Position 4 Row 2 mm Press-Fit Tray
Amphenol TCS Höghastighets/modulära kontakter HD Express Daughter Card 4Pr, 16Pos
Datablad
40Förväntad 2026-05-07
Min.: 1
Multipla: 1

Daughter Card Module 128 Position 4 Row 2 mm Press-Fit Tray