Thermal Bridge Technology for I/O Applications

TE Connectivity's (TE) Thermal Bridge Technology for Input/Output (I/O) Applications is a mechanical alternative to traditional gap pads or thermal interface materials. Thermal Bridge Technology offers superior thermal resistance while not completely relying on high levels of compression to achieve optimal thermal transfer. This technology features improved thermal resistance, better reliability and durability, and easier serviceability. TE Thermal Bridge Technology is ideal for 5G/wireless, servers, Ethernet SP routing, and high-performance computing (HPC) applications. 

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TE Connectivity I/O-kontaktdon CAGE ASSY,SFP-DD 1X1 THERMAL BRIDGE
Datablad
446På lager
Min.: 1
Multipla: 1

Cage Assemblies 40 Position Through Hole Press Fit Right Angle
TE Connectivity I/O-kontaktdon SFP+ 1x1 Cage Assy Thermal Bridge
Datablad
501På lager
Min.: 1
Multipla: 1

Cage Assemblies Female 20 Position 14.25 mm Through Hole Press Fit Right Angle - 55 C + 85 C
TE Connectivity I/O-kontaktdon CAGE ASSEMBLY QSFP28 1X1 THERMAL
Datablad
305Förväntad 2026-10-19
Min.: 1
Multipla: 1
Cages Female 38 Position 19 mm Press Fit Solder Pin Straight - 40 C + 85 C
TE Connectivity I/O-kontaktdon CAGE ASSEMBLY QSFP-DD 1X1, SPRING
Datablad
Ledtid för icke lagerfört 8 Veckor
Min.: 896
Multipla: 896

Cages Female 76 Position 19 mm Panel Mount Straight - 55 C + 85 C
TE Connectivity I/O-kontaktdon CAGE ASSEMBLY 1X4 QSFP28 TB
Datablad
Ledtid för icke lagerfört 9 Veckor
Min.: 2 700
Multipla: 27

Cage Assemblies Female Tin Through Hole Press Fit Right Angle - 40 C + 85 C