TS391 No-Clean Solder Paste

Chip Quik TS391 No-Clean Solder Paste is a dispense grade, synthetic paste with no refrigeration required to maintain shelf life. The no-clean solder paste provides excellent wetting compatibility on most board finishes, exhibiting a wide process window with low voiding and long stencil life. Chip Quik TS391 solder paste leaves a clear residue and supports printing speeds up to 125mm/sec. This solder paste is available with three different alloy compositions, each with different melting points, in 15g, 35g, 50g, 250g, and 500g packaging. The RoHS II and REACH compliant paste features a T4 mesh size, 20µm to 38µm range, and a ROL0 flux classification.

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Antal RoHS Produkt
Typ
Legering
Förpackningstyp
Chip Quik Lod Paste No-Clean 15g Sn63/Pb37 T4
Datablad
209På lager
255Förväntad 2026-02-25
Min.: 1
Multipla: 1
Solder Paste Tin/Lead, No Clean, Thermally Stable Sn63/Pb37 Syringe
Chip Quik Lod Paste No-Clean 35g Sn63/Pb37 T4
Datablad
134På lager
Min.: 1
Multipla: 1
Solder Paste Tin/Lead, No Clean, Thermally Stable Sn63/Pb37 Syringe
Chip Quik Lod Paste No-Clean 250g Sn63/Pb37 T4
Datablad
36På lager
41Förväntad 2026-03-05
Min.: 1
Multipla: 1
Solder Paste Tin/Lead, No Clean, Thermally Stable Sn63/Pb37 Jar
Chip Quik Lod Paste No-Clean 50g Sn63/Pb37 T4
Datablad
148På lager
247Förväntad 2026-02-16
Min.: 1
Multipla: 1
Solder Paste Tin/Lead, No Clean, Thermally Stable Sn63/Pb37 Jar
Chip Quik Lod Paste NoClean 15g Sn42/Bi57.6/Ag0.4 T4
Datablad
261På lager
Min.: 1
Multipla: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn42/Bi57.6/Ag0.4 Syringe
Chip Quik Lod Paste NoClean 35g Sn42/Bi57.6/Ag0.4 T4
Datablad
92På lager
Min.: 1
Multipla: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn42/Bi57.6/Ag0.4 Syringe
Chip Quik Lod Paste NoClean 250g Sn42/Bi57.6/Ag0.4 T4
Datablad
45På lager
Min.: 1
Multipla: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn42/Bi57.6/Ag0.4 Jar
Chip Quik Lod Paste NoClean 15g T4 Sn96.5/Ag3.0/Cu0.5
Datablad
207På lager
Min.: 1
Multipla: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn96.5/Ag03/Cu0.5 Syringe
Chip Quik Lod Paste NoClean 35g T4 Sn96.5/Ag3.0/Cu0.5
Datablad
92På lager
Min.: 1
Multipla: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn96.5/Ag03/Cu0.5 Syringe
Chip Quik Lod Paste NoCln 250g T4 Sn96.5/Ag3.0/Cu0.5
Datablad
65På lager
167Förväntad 2026-03-02
Min.: 1
Multipla: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn96.5/Ag03/Cu0.5 Jar
Chip Quik Lod Paste NoClean 50g T4 Sn96.5/Ag3.0/Cu0.5
Datablad
271På lager
Min.: 1
Multipla: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn96.5/Ag03/Cu0.5 Jar
Chip Quik Lod Paste No-Clean 500g Sn63/Pb37 T4
Datablad
9På lager
Min.: 1
Multipla: 1
Solder Paste Tin/Lead, No Clean, Thermally Stable Sn63/Pb37 Cartridge
Chip Quik Lod Paste No-Clean 50g Sn42/Bi57.6/Ag0.4 T4
Datablad
57På lager
104Förväntad 2026-02-23
Min.: 1
Multipla: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn42/Bi57.6/Ag0.4 Jar
Chip Quik Lod Paste No-Clean 500g Sn42/Bi57.6/Ag0.4 T4
Datablad
Ledtid för icke lagerfört 6 Veckor
Min.: 1
Multipla: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn42/Bi57.6/Ag0.4 Cartridge
Chip Quik Lod Paste NoCln 500g T4 Sn96.5/Ag3.0/Cu0.5
Datablad
N/A
Min.: 1
Multipla: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn96.5/Ag03/Cu0.5 Cartridge