onsemi DSN2 30V Schottky barrier diodes are optimized for low forward voltage drop and low leakage current. The DSN2 Dual Silicon no-lead package of these onsemi Schottky barrier diodes is a chip level package using solderable metal contacts under the package similar to DFN style packages. The DSN2 style package enables 100% utilization of the package area for active silicon, offering a significant performance per board area advantage compared to products in plastic molded packages. The low thermal resistance of these onsemi devices enables designers to meet the challenging task of achieving higher efficiency and meeting reduced space requirements. These new 30V Schottky barrier diodes provide an ideal solution for the increasing number of applications where board space is restricted such as mobile handsets, MP3 players and digital cameras.