HybridPACK™ Drive G2 Modules

Infineon Technologies HybridPACK™ Drive G2 Modules are compact power modules designed for hybrid and electric vehicle traction. The Infineon Technologies G2 modules offer scalable performance levels using Si or SiC technologies and different chipsets, maintaining the same module size. Introduced in 2017 with silicon EDT2 technology, it was optimized for efficiency in real-world driving. In 2021, a CoolSiC™ version was introduced, offering higher cell density and better performance. In 2023, the second generation, HybridPACK Drive G2, was launched with EDT3 (Si IGBT) and CoolSiC™ G2 MOSFET technologies, providing ease of use and integration options for sensors, enabling up to 300kW performance within 750V and 1200V classes.

Typer av Åtskilda halvledare

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Infineon Technologies Åtskilda halvledaremoduler HybridPACK Drive G2 module 3På lager
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Discrete Semiconductor Modules SiC Press Fit DIP-7
Infineon Technologies Åtskilda halvledaremoduler HybridPACK Drive G2 module with SiC MOSFET 5På lager
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Discrete Semiconductor Modules SiC Press Fit
Infineon Technologies MOSFET-moduler HybridPACK Drive G2 module 3På lager
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MOSFET Modules Si Screw Mount HybridPACK
Infineon Technologies MOSFET-moduler HybridPACK Drive G2 module 2På lager
6På beställningen
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MOSFET Modules Screw Mount HybridPACK
Infineon Technologies Åtskilda halvledaremoduler HYBRID PACK DRIVE G2 SIC 11På lager
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Discrete Semiconductor Modules SiC
Infineon Technologies Åtskilda halvledaremoduler HYBRID PACK DRIVE G2 SI 9På lager
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Discrete Semiconductor Modules Si
Infineon Technologies IGBT-moduler HYBRID PACK DRIVE G2 SI 1På lager
12Förväntad 2026-02-13
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IGBT Modules Si Press Fit
Infineon Technologies Åtskilda halvledaremoduler HYBRID PACK DRIVE G2 SI 9På lager
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Multipla: 1

Discrete Semiconductor Modules Si