QspiNAND Flash Memory

Winbond QspiNAND Flash Memory is high-performance, low-power memory built with Single-Level Cell (SLC) memory technology and implementing 1-bit Error Correction Code (ECC) on all read and write operations. The integrated ECC detects and corrects errors and enables contiguous good memory (bad block management). This feature offloads these functions from an external controller. The QspiNAND Flash Memory also supports Executive-in-Place (XiP) functionality, in which an SoC or processor executes application code directly from the external flash memory without shadowing it to DRAM.

Resultat: 4
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Winbond NAND-flash 512Mb Serial NAND flash, 3V 3 328På lager
Min.: 1
Multipla: 1
Max.: 100

SMD/SMT WSON-8 W25N512GV 512 Mbit SPI 64 M x 8 Asynchronous 8 bit 2.7 V 3.6 V 35 mA - 40 C + 85 C Tube
Winbond NAND-flash 1G-bit Serial NAND flash, 3V 430På lager
Min.: 1
Multipla: 1
Max.: 100

SMD/SMT TFBGA-24 W25N01GV 1 Gbit SPI 128 M x 8 Asynchronous 8 bit 2.7 V 3.6 V 35 mA - 40 C + 85 C Tray

Winbond NAND-flash 1G-bit Serial NAND flash, 3V 1 180På lager
Min.: 1
Multipla: 1
Max.: 100

SMD/SMT SOIC-16 W25N01GV 1 Gbit SPI 128 M x 8 Asynchronous 8 bit 2.7 V 3.6 V 35 mA - 40 C + 85 C Tube
Winbond NAND-flash 1G-bit Serial NAND flash, 1.8V 81På lager
Min.: 1
Multipla: 1
Max.: 100

SMD/SMT SOIC-16 W25N01JW 1 Gbit SPI 128 M x 8 Asynchronous 8 bit 1.7 V 1.95 V 35 mA - 40 C + 85 C Tube