Sn95.5/Ag4.0/Cu0.5 Solder Spheres for BGAs

Chip Quik Sn95.5/Ag4.0/Cu0.5 Solder Spheres for BGAs are manufactured from virgin materials to meet or exceed the requirements of building or repairing BGA packages. These solder spheres also exceed MIL standards and IPC for size tolerances and purity levels. The Sn95.5/Ag4.0/Cu0.5 solder spheres are available in nominal sizes from 0.20mm to 0.76mm (8mil to 30mil). These solder spheres are Lead-free and REACH-compliant. The Sn95.5/Ag4.0/Cu0.5 solder spheres are compliant with RoHS 3, REACH, and conflict minerals. These solder spheres operate at 217°C (423°F) melting point and are available in up to 0.60mm sphere diameter.

Resultat: 4
Välj Bild Artikelnummer
 Tillverk:
Beskrivning Datablad Tillgänglighet Prissättning: (SEK) Filtrera resultaten i tabellen efter enhetspris baserat på din kvantitet.
Antal RoHS Produkt
Typ
Legering
Diameter
Innehåller bly
Chip Quik Lod Lod Spheres Sn95.5/Ag4.0/Cu0.5 0.50mm diameter 25K Bottle
Datablad
3På lager
Min.: 1
Multipla: 1

Solder Spheres Lead Free Sn95.5/Ag04/Cu0.5 0.5 mm
Chip Quik Lod Lod Spheres Sn95.5/Ag4.0/Cu0.5 0.60mm diameter 25K Bottle
Datablad
5På lager
Min.: 1
Multipla: 1

Solder Spheres Lead Free Sn95.5/Ag04/Cu0.5 0.6 mm
Chip Quik Lod Lod Spheres Sn95.5/Ag4.0/Cu0.5 0.30mm diameter 25K Bottle
Datablad
1På lager
Min.: 1
Multipla: 1

Solder Spheres Lead Free Sn95.5/Ag04/Cu0.5 0.3 mm
Chip Quik Lod Lod Spheres Sn96.5/Ag3.0/Cu0.5 .044" (1.1mm) diameter 6K Bottle (SAC305 lead-free solder balls)
Datablad
10Förväntad 2026-02-23
Min.: 1
Multipla: 1

Solder Spheres Lead Free Sn96.5/Ag3.0/Cu0.5 1.1 mm No