TGP 2202SF Silicone-Free GAP PAD®

Bergquist TGP 2202SF Silicone-Free GAP PAD® are high-performance, 2.0W/m-K, thermally conductive gap filling material that is silicone-free by design and offers exceptionally low interfacial resistances to adjacent surfaces. The gap pads are specifically designed for silicone-sensitive applications. The material’s construction features a 0.5mil PET film on one side and a natural tack on the other. The natural tack eliminates the need for an additional adhesive layer. The Bergquist TGP 2202SF Silicone-Free GAP PAD® are available in sheet form and are gray in appearance. Typical thermal management applications include hard drives, set-top boxes, and optical applications.

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Antal RoHS ECAD-modell Produkt
Typ
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Material
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Genomslagsspänning
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Maximal drifttemperatur
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Bergquist Company Termiska gränssnittsprodukter GAP PAD, Conductive, Sil-Free, 9"x18" Sheet, 0.040" Thickness, 1 Side Tack
Datablad
3Förväntad 2026-06-01
Min.: 1
Multipla: 1

Gap Fillers / Gap Pads / Sheets Thermal Pad Non-standard Silicone-Free 2 W/m-K 6 kVAC Gray - 40 C + 125 C 457.2 mm 228.6 mm 1.016 mm UL 94 V-0 2202SF / TGP 2202SF
Bergquist Company Termiska gränssnittsprodukter GAP PAD, Conductive, Sil-Free, 9"x18" Sheet, 0.010" Thickness, 1 Side Tack
Datablad
Ledtid för icke lagerfört 3 Veckor
Min.: 1
Multipla: 1

Gap Fillers / Gap Pads / Sheets Thermal Pad Non-standard Silicone-Free 2 W/m-K 6 kVAC Gray - 40 C + 125 C 457.2 mm 228.6 mm 0.254 mm UL 94 V-0 2202SF / TGP 2202SF