EasyPACK™ C Series CoolSiC MOSFETs Modules

Infineon Technologies EasyPACK™ C Series CoolSiC MOSFETs Modules combine second-generation CoolSiC trench MOSFETs with the low inductance Easy C series platform and .XT interconnect technology. These Infineon modules deliver ultra-low switching losses, tighter parasitic control, and enhanced robustness during power cycling. Rugged PressFIT pins, integrated NTC sensing, integrated mounting clamps, and high CTI insulation streamline assembly and support demanding mission profiles. Available in four-pack (F4) and 3-level (F3) topologies, the series is offered in 8mΩ and 13mΩ resistance classes to help users raise switching frequency, shrink magnetics, and boost power density while maintaining EMI performance and thermal margin.

Resultat: 6
Välj Bild Artikelnummer Tillverk: Beskrivning Datablad Tillgänglighet Prissättning: (SEK) Filtrera resultaten i tabellen efter enhetspris baserat på din kvantitet. Antal RoHS ECAD-modell Teknologi Monteringsstil Vds - Dräneringskällans genombrottsspänning Id - Kontinuerlig dräneringsström Rds på - Dräneringskällans resistans Vgs - Gate-källans spänning Vgs th - Gate-källans tröskelspänning Minsta drifttemperatur Maximal drifttemperatur Pd - Effektavledning Serie Förpackning
Infineon Technologies MOSFET-moduler EasyPACK 2C CoolSiC MOSFET M2 .XT, 3-level module 1200 V, 8 mOhm with NTC temperature sensor and high current PressFIT contact technology 37På lager
Min.: 1
Multipla: 1

SiC Press Fit 1.2 kV 95 A 16.8 mOhms - 10 V, + 25 V 4.3 V - 40 C + 175 C 20 mW EasyPACK C series Tray
Infineon Technologies MOSFET-moduler EasyPACK 2C CoolSiC MOSFET M2 .XT, 3-level module 1200 V, 8 mOhm with NTC temperature sensor, pre-applied thermal interface material 2.0 and high current PressFIT contact technology 16På lager
Min.: 1
Multipla: 1

SiC Press Fit 1.2 kV 95 A 16.8 mOhms - 10 V, + 25 V 4.3 V - 40 C + 175 C 20 mW EasyPACK C series Tray
Infineon Technologies MOSFET-moduler EasyPACK 1C CoolSiC MOSFET M2 .XT, fourpack module 1200 V, 13 mOhm with NTC temperature sensor and high current PressFIT contact technology 25På lager
Min.: 1
Multipla: 1

SiC Press Fit 1.2 kV 60 A 25.2 mOhms - 10 V, + 25 C 4.35 V - 40 C + 175 C 20 mW EasyPACK C series Tray
Infineon Technologies MOSFET-moduler EasyPACK 2C CoolSiC MOSFET M2 .XT, fourpack module 1200 V, 8 mOhm with NTC temperature sensor and high current PressFIT contact technology 19På lager
Min.: 1
Multipla: 1

SiC Press Fit 1.2 kV 95 A 16.8 mOhms - 10 V, + 25 V 4.3 V - 40 C + 175 C 20 mW EasyPACK C series Tray
Infineon Technologies MOSFET-moduler EasyPACK 2C CoolSiC MOSFET M2 .XT, fourpack module 1200 V, 8 mOhm with NTC temperature sensor, pre-applied thermal interface material 2.0 and high current PressFIT contact technology 11På lager
Min.: 1
Multipla: 1

SiC Press Fit 1.2 kV 100 A 16.8 mOhms - 10 V, + 25 V 4.3 V - 40 C + 175 C 20 mW EasyPACK C series Tray
Infineon Technologies MOSFET-moduler EasyPACK 1C CoolSiC MOSFET M2 .XT, fourpack module 1200 V, 13 mOhm with NTC temperature sensor, pre-applied thermal interface material 2.0 and high current PressFIT contact technology
30Förväntad 2027-02-04
Min.: 1
Multipla: 1

SiC Press Fit 1.2 kV 60 A 25.2 mOhms - 10 V, + 25 V 4.3 V - 40 C + 175 C 20 mW EasyPACK C series Tray