UCC23513EVM-014

Texas Instruments
595-UCC23513EVM-014
UCC23513EVM-014

Tillverk:

Beskrivning:
Strömhantering, IC-utvecklingsverktyg UCC23513EVM-014

På lager: 1

Lager:
1
Kan skickas omedelbart
På beställningen:
6
Förväntad 2026-05-04
Fabrikens ledtid:
12
Veckor Uppskattad tillverkningstid i fabriken för kvantiteter som är större än vad som visas.
Minst: 1   Flera: 1   Maximalt: 5
Enhetspris:
-,-- kr
Ext. pris:
-,-- kr
Est. Pris:

Prissättning (SEK)

Antal Enhetspris
Ext. pris
580,67 kr 580,67 kr

Produktattribut Attributvärde Välj attribut
Texas Instruments
Produktkategori: Strömhantering, IC-utvecklingsverktyg
RoHS-direktivet:
Evaluation Modules
Gate Driver
35 V
UCC23513
UCC23513-014
Märke: Texas Instruments
Monteringsland: US
Distributionsland: Not Available
Ursprungsland: US
Produkttyp: Power Management IC Development Tools
Fabriksförpackningskvantitet: 1
Underkategori: Development Tools
Enhetens vikt: 136,080 g
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Attribut som valts: 0

TARIC:
8473302000
CNHTS:
8543909000
CAHTS:
8473302000
USHTS:
8473301180
MXHTS:
8473300401
ECCN:
EAR99

Motor Control Solutions

Texas Instruments Motor Control Solutions leverage TI's rich history in advanced motor control expertise, combined with TI's analog and embedded processing portfolios, to deliver complete motor system solutions. TI provides a broad motor expertise, a wide breadth of selection, and comprehensive support for efficient, reliable, and cost-effective drive and control solutions.

UCC23513EVM-014 Gate Driver Evaluation Module

Texas Instruments UCC23513EVM-014 Gate Driver Evaluation Module (EVM) is designed to evaluate TI's 5kVRMS isolated single-channel gate driver with opto-compatible input, UCC23513. The input is current driven, requiring between 7mA and 16mA for device turn-on, and can be reverse biased for the turn-off. The device can have a 4A source and 5A sink peak output current for driving Si MOSFETs, IGBTs, and WBG devices, i.e., SiC and GaN transistors. The Texas Instruments UCC23513EVM-014 is populated with clips and 2-position headers for flexibility in connecting power and signal inputs, along with signal test points and large GND vias to enable the installation of ground springs. The PCB layout is optimized with a minimal loop area in the input and output paths. It showcases a high-voltage design between the primary and secondary sides with 8mm creepage.