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DF65-4S-1.7C

Name: Hirose Electric DF65-4S-1.7C
Brand: Hirose Connector
SKU: 798-DF65-4S-1.7C
Price: 1.97 SEK
Availability: InStock

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Se produktspecifikationer

Mouser nr:

798-DF65-4S-1.7C

Tillverk: Nr.:

DF65-4S-1.7C

Tillverk:

Hirose Connector

Beskrivning:

Ström till kortet 1.7mm Low Profile BtW Socket 4P

Datablad:

DF65-4S-1.7C Datablad (PDF)

ECAD-modell:

Ladda ned den kostnadsfria Libary Loader för att omvandla denna fil för ditt ECAD-verktyg. Läs mer om ECAD-modellen.

Mer information

Lär dig mer om Hirose Connector DF65-4S-1.7C

På lager: 5 616

Lager:: 5 616 Kan skickas omedelbart

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Fabrikens ledtid:: 5 Veckor Uppskattad tillverkningstid i fabriken för kvantiteter som är större än vad som visas.

Ange kvantitet:

Minst: 1 Flera: 1

Enhetspris:

-,-- kr

Ext. pris:

-,-- kr

Est. Pris:

Prissättning (SEK)

Antal	Enhetspris	Ext. pris
	1,97 kr	1,97 kr
	1,68 kr	16,80 kr
	1,50 kr	37,50 kr
	1,35 kr	135,00 kr
	1,21 kr	363,00 kr
	1,16 kr	1.160,00 kr
	1,12 kr	2.800,00 kr
	1,04 kr	10.400,00 kr
	0,981 kr	19.620,00 kr

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Produktattribut	Attributvärde	Välj attribut
Tillverkare:	Hirose Electric
Produktkategori:	Ström till kortet
RoHS-direktivet:
Produkttyp:	Power to the Board
Kontaktkön:	Socket (Female)
Märkström:	4 A
Märkspänning:	50 V
Antal positioner:	4 Position
Monteringsstil:	Cable Mount / Free Hanging
Termineringsstil:	Crimp
Delning:	1.7 mm
Serie:	DF65
Förpackning:	Bulk
Handelsnamn:	SnapBee
Märke:	Hirose Connector
Kontaktmaterial:	Phosphor Bronze
Kontaktplätering:	Tin
Höljfärg:	Beige
Höljets material:	Liquid Crystal Polymer (LCP)
Isoleringsmotstånd:	100 MOhms
Maximal drifttemperatur:	+ 105 C
Minsta drifttemperatur:	- 40 C
Monteringsvinkel:	Vertical
Antal rader:	1 Row
Produkt:	Sockets
Fabriksförpackningskvantitet:	100
Underkategori:	Power Connectors
Maximal ledningsdimension:	24 AWG
Minimal ledningsdimension:	28 AWG
Ledningsdimensionens räckvidd:	28 AWG to 24 AWG
Del # Alias:	666-6007-3-00
Enhetens vikt:	50 mg

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Datablad

DF65-4S-1.7C Datablad (PDF)

Models

Product Catalogs

Catalog Page

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TARIC:: 8536693000
CNHTS:: 8547200000
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
MXHTS:: 8536699999
BRHTS:: 85366990
ECCN:: EAR99

DF65 1.7mm Pitch Board-to-Wire Connectors

Hirose Electric DF65 1.7mm Pitch Board-to-Wire Connectors are low-profile components featuring enhanced contact reliability and locking structure. The locking structure reinforces the connection between the wire side and the header. This secure connection prevents misalignment of the wire side due to improper wire routing. DF65 connectors offer a vertical mating style that reduces assembly time and maximizes board space. The two-point contact structure of Hirose DF65 Connectors provides high reliability, a low mated height of 1.8mm, and an effective mating length of 0.35mm. The DF65 1.7mm Pitch Board-to-Wire Connectors are ideal for use in power supplies.

Smartphone & PC Solutions

Hirose Electric offers ultra-fine pitch solutions with dimensions down to 0.25mm, supporting small form factors without sacrificing performance. These solutions feature high-speed data, high-current delivery, EMI control, and rugged locking mechanisms, ensuring reliable operation. Hirose connectors meet rigorous demands in sleek, space-constrained designs where durability, precision, and signal integrity are crucial. Suitable applications include displays, batteries, cameras, antennas, USB interfaces, and touch functionality.

Medical Solutions

Hirose Electric Medical Solutions include high-performance connectors engineered for precision, durability, and reliability in demanding applications. Products offered include board-to-board, wire-to-board, FPC/FFC, circular, and coaxial connectors with IP67/IP68 sealing to protect against debris, dust, and moisture ingress. Features include EMI shielding, extended mating cycles, and secure locking, ensuring stable interference-free performance. The miniaturized products from Hirose support compact, high-density systems, while hybrid signal/power designs and RoHS/IEC compliance meet the evolving needs of diagnostic imaging, patient monitoring, therapy systems, and wearable medical tech.