9713-4X10

3M Electronic Specialty
517-9713-4X10
9713-4X10

Tillverk:

Beskrivning:
Adhesivtejper XYZ-Axis Electrically Conductive Tape 4 in x 10yds Roll

På lager: 32

Lager:
32 Kan skickas omedelbart
Fabrikens ledtid:
12 Veckor Uppskattad tillverkningstid i fabriken för kvantiteter som är större än vad som visas.
Minst: 1   Flera: 1
Enhetspris:
-,-- kr
Ext. pris:
-,-- kr
Est. Pris:
Denna produkt levereras UTAN KOSTNAD

Prissättning (SEK)

Antal Enhetspris
Ext. pris
1.220,47 kr 1.220,47 kr

Produktattribut Attributvärde Välj attribut
3M
Produktkategori: Adhesivtejper
RoHS-direktivet:  
Tapes
Conductive
XYZ-Axis Electrically Conductive Tape is an Isotropically Conductive Pressure Sensitive Tape
Acrylic
4 in
101.6 mm
10 yd
9.14 m
Märke: 3M Electronic Specialty
Produkttyp: Tape
Serie: 9713
Fabriksförpackningskvantitet: 6
Underkategori: Supplies
Tjocklek: 0.0889 mm
Del # Alias: 7000048874
Enhetens vikt: 622 g
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Attribut som valts: 0

USHTS:
3506911000
ECCN:
EAR99

Conductive Adhesive 9712 & 9713 Transfer Tape

3M Electronic Specialty Conductive Adhesive 9712 and 9713 Transfer Tape offers XYZ-axis-based conductivity in various conductive adhesives, carriers, and fillers, providing enhanced EMI performance. This tape features an adhesive that is coated directly to the liners for a more conformable and flexible double-sided tape that provides a conductive carbon scrim carrier. The tape is available in multiple thicknesses and offers EMI/RFI shielding and grounding across multiple frequencies. 3M Electronic Specialty 9712 and 9713 series tape is designed for EMI shielding and ground applications, enabling devices to meet electromagnetic compatibility requirements.

Thermally Conductive Interface Pads

3M™ Thermally Conductive Interface Pads are designed to provide a preferential heat transfer path between heat-generating components, heat sinks, and other cooling devices. The interface pads consist of a highly conformable and slightly tacky silicone elastomer with thermally conductive ceramic particles, which help in providing enhanced thermal conductivity and excellent insulation performance. The high thermal conductivity and dielectric strength pads can be die-cut to fit individual applications. Typical applications include Integrated Circuit (IC) chip packaging heat conduction, heat sink interface, LED board Thermal Interface Material (TIM), and Chip ON Film (COF) heat conduction.