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5591-25

Name: 3M 5591-25
Brand: 3M Electronic Specialty
SKU: 517-5591-25
Price: 315.88 SEK
Availability: InStock

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Mouser nr:

517-5591-25

Tillverk: Nr.:

5591-25

Tillverk:

3M Electronic Specialty

Beskrivning:

Termiska gränssnittsprodukter WX300901310 3M(TM) THERMALLY COND INTERFACE PAD 5591, 210MM X 300MM 2.5MM

Datablad:

5591-25 Datablad (PDF)

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På lager: 106

Lager:: 106 Kan skickas omedelbart

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Ange kvantitet:

Minst: 1 Flera: 1

Enhetspris:

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Ext. pris:

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Est. Pris:

Prissättning (SEK)

Antal	Enhetspris	Ext. pris
	315,88 kr	315,88 kr
	294,41 kr	2 944,10 kr
	276,21 kr	5 524,20 kr
	270,21 kr	13 510,50 kr
	260,40 kr	26 040,00 kr
	246,99 kr	49 398,00 kr

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Produktattribut	Attributvärde	Välj attribut
Tillverkare:	3M
Produktkategori:	Termiska gränssnittsprodukter
Produkt:	Gap Fillers / Gap Pads / Sheets
Typ:	Thermally Conductive Tape
Paket/låda:	Non-standard
Material:	Silicone Elastomer
Värmeledningsförmåga:	1 W/m-K
Färg:	White
Minsta drifttemperatur:	- 50 C
Maximal drifttemperatur:	+ 125 C
Längd:	210 mm
Bredd:	300 mm
Tjocklek:	2.5 mm
Brännbarhetsklass:	UL 94 V-0
Serie:	5591
Märke:	3M Electronic Specialty
Produkttyp:	Thermal Interface Products
Fabriksförpackningskvantitet:	10
Underkategori:	Thermal Management
Del # Alias:	5591 08806080063735 7010321481
Enhetens vikt:	284,634 g

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Datablad

5591-25 Datablad (PDF)

CNHTS:: 3824999999
USHTS:: 3506911000
ECCN:: EAR99

Thermally Conductive Interface Pads

3M™ Thermally Conductive Interface Pads are designed to provide a preferential heat transfer path between heat-generating components, heat sinks, and other cooling devices. The interface pads consist of a highly conformable and slightly tacky silicone elastomer with thermally conductive ceramic particles, which help in providing enhanced thermal conductivity and excellent insulation performance. The high thermal conductivity and dielectric strength pads can be die-cut to fit individual applications. Typical applications include Integrated Circuit (IC) chip packaging heat conduction, heat sink interface, LED board Thermal Interface Material (TIM), and Chip ON Film (COF) heat conduction.

Thermally Conductive Adhesive Tapes

3M™ Thermally Conductive Tapes offer a wide range that can be used in various thermal interface solutions, including cushion gasket tape, XYZ-axis thermally conductive tape, double-sided tape, adhesive transfer tape, and water contact indicator tape variants. These thin, highly conformable thermal interfaces and heat-spreading tapes provide high adhesion and excellent thermal conductivity. The tapes apply quickly and easily. A good dielectric strength makes these tapes appropriate for applications, including bonding heat sinks, heat spreaders, and other cooling devices to the IC packages, power transistors, and other heat-generating components.

Thermal Interface Solutions

3M™ Thermal Interface Solutions includes electrically conductive transfer tapes and conductive interface pads. The electrically conductive tapes are a wide range that can be used in various thermal interface solutions. Thermally conductive silicone interface pads are designed to provide a heat transfer path between heat-generating components, heat sinks, and other cooling devices.