5583S-20

3M Electronic Specialty
517-5583S-20
5583S-20

Tillverk:

Beskrivning:
Termiska gränssnittsprodukter WX300950606 3M(TM) THERMALLY COND INTERFACE PAD 5583S, 210MM X 300MM 2.0MM

ECAD-modell:
Ladda ned den kostnadsfria Libary Loader för att omvandla denna fil för ditt ECAD-verktyg. Läs mer om ECAD-modellen.

På lager: 51

Lager:
51
Kan skickas omedelbart
På beställningen:
20
Fabrikens ledtid:
15
Veckor Uppskattad tillverkningstid i fabriken för kvantiteter som är större än vad som visas.
Minst: 1   Flera: 1
Enhetspris:
-,-- kr
Ext. pris:
-,-- kr
Est. Pris:
Denna produkt levereras UTAN KOSTNAD

Prissättning (SEK)

Antal Enhetspris
Ext. pris
485,16 kr 485,16 kr
414,09 kr 4.140,90 kr
393,82 kr 7.876,40 kr
385,97 kr 23.158,20 kr
379,76 kr 37.976,00 kr
379,65 kr 98.709,00 kr

Produktattribut Attributvärde Välj attribut
3M
Produktkategori: Termiska gränssnittsprodukter
Gap Fillers / Gap Pads / Sheets
Thermally Conductive Tape
Non-standard
Silicone Elastomer
1 W/m-K
White
- 40 C
+ 125 C
210 mm
155 mm
2 mm
UL 94 V-0
5583S
Märke: 3M Electronic Specialty
Produkttyp: Thermal Interface Products
Fabriksförpackningskvantitet: 20
Underkategori: Thermal Management
Del # Alias: 5583S 08806080063964 7100099386
Enhetens vikt: 223,625 g
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Attribut som valts: 0

CNHTS:
3824999999
USHTS:
3919905060
KRHTS:
3919900000
MXHTS:
3919909900
ECCN:
EAR99

Thermally Conductive Interface Pads

3M™ Thermally Conductive Interface Pads are designed to provide a preferential heat transfer path between heat-generating components, heat sinks, and other cooling devices. The interface pads consist of a highly conformable and slightly tacky silicone elastomer with thermally conductive ceramic particles, which help in providing enhanced thermal conductivity and excellent insulation performance. The high thermal conductivity and dielectric strength pads can be die-cut to fit individual applications. Typical applications include Integrated Circuit (IC) chip packaging heat conduction, heat sink interface, LED board Thermal Interface Material (TIM), and Chip ON Film (COF) heat conduction.

Thermally Conductive Adhesive Tapes

3M™ Thermally Conductive Tapes offer a wide range that can be used in various thermal interface solutions, including cushion gasket tape, XYZ-axis thermally conductive tape, double-sided tape, adhesive transfer tape, and water contact indicator tape variants. These thin, highly conformable thermal interfaces and heat-spreading tapes provide high adhesion and excellent thermal conductivity. The tapes apply quickly and easily. A good dielectric strength makes these tapes appropriate for applications, including bonding heat sinks, heat spreaders, and other cooling devices to the IC packages, power transistors, and other heat-generating components.

Thermal Interface Solutions

3M™ Thermal Interface Solutions includes electrically conductive transfer tapes and conductive interface pads. The electrically conductive tapes are a wide range that can be used in various thermal interface solutions. Thermally conductive silicone interface pads are designed to provide a heat transfer path between heat-generating components, heat sinks, and other cooling devices.