2000974-1

TE Connectivity / Raychem
571-2000974-1
2000974-1

Tillverk:

Beskrivning:
Fiberoptiska kontaktdon 2P V66.1 MODULE CARD PLUG CONNECTOR KIT

ECAD-modell:
Ladda ned den kostnadsfria Libary Loader för att omvandla denna fil för ditt ECAD-verktyg. Läs mer om ECAD-modellen.
Denna produkt kräver eventuellt ytterligare dokumentation vid export från USA.

Tillgänglighet

Lager:
Ej på lager
Fabrikens ledtid:
25 Veckor Uppskattad tillverkningstid i fabriken.
Minst: 1   Flera: 1
Enhetspris:
-,-- kr
Ext. pris:
-,-- kr
Est. Pris:
Denna produkt levereras UTAN KOSTNAD

Prissättning (SEK)

Antal Enhetspris
Ext. pris
7.617,25 kr 7.617,25 kr

Produktattribut Attributvärde Välj attribut
TE Connectivity
Produktkategori: Fiberoptiska kontaktdon
Leveransrestriktioner:
 Denna produkt kräver eventuellt ytterligare dokumentation vid export från USA.
RoHS-direktivet:  
VITA 66.1
Connector Shell Kits
2 Position
- 20 C
+ 85 C
Kroppsmaterial: Aluminum Alloy
Märke: TE Connectivity / Raychem
Egenskaper: Comes unassembled
Produkttyp: Fiber Optic Connectors
Fabriksförpackningskvantitet: 1
Underkategori: Fiber Optic
Handelsnamn: VITA 66
Typ: Plug Connector Kit
Enhetens vikt: 37,200 g
Hittade produkter:
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Attribut som valts: 0

TARIC:
8536700099
CNHTS:
8538900000
CAHTS:
8536700000
USHTS:
8536700000
JPHTS:
853670000
MXHTS:
8536700100
BRHTS:
85367000
ECCN:
EAR99

VITA 66 Optical Backplane Interconnects

TE Connectivity's VITA 66 Ruggedized Optical Backplane Interconnects address fiber-optic connection needs for the VPX ecosystem. The VITA 66 standard for optics gives you the choice of MT array connectors, ARINC 801 termini, or expanded beam (EB) contacts using a common module. With an aerospace pedigree, each style of termini offers different benefits in terms of density, ruggedness, repairability, and other characteristics. TE Ruggedized Optical Backplane interconnect system provides a high-density, blind-mate optical interconnect in a backplane/daughtercard configuration. The fiber optic ribbon cable interconnect feeds through the backplane to removable system modules using MT ferrules. The VITA 66.1 modules are full width and accommodate two MT ferrules. TE Connectivity's VITA 66.4 modules are half-width and hold a single MT ferrule.

VPX Ecosystem

TE Connectivity’s VPX Ecosystem systems gives designers a complete array for high-speed data, optical, RF, power, and mezzanine connectivity. More choice means more flexibility in achieving specific system architectures with standards-based solutions. VPX lets the user achieve the high-speed signal integrity advanced applications require in rugged, reliable connectors. VPX is a ruggedized approach to embedded computing that aims to satisfy high-speed processing needs in harsh environments such as flight, ground defense, and other military applications.

Ruggedized Optical Backplane Interconnect System

TE Connectivity's (TE) Ruggedized Optical Backplane Interconnect System provides a high-density, blind-mate optical interconnect in a backplane/daughtercard configuration. The system meets VITA 66.1 and 66.4 standards with full-size or half-size modules. The VITA 66.1 modules are full width and accommodate two MT ferrules, while the VITA 66.4 modules are half width and hold a single MT ferrule. Two modules can be fit into the same space as a VITA 66.1 module. The plug (daughtercard) connector housing utilizes a slot feature to facilitate cleaning the MT interfaces, and locating post features help ensure a proper position on the backplane and daughtercard.