170673-2278

Molex
538-170673-2278
170673-2278

Tillverk:

Beskrivning:
Standard kortkantskontakter EDGELINE 278CKTS 0.062 PCB

ECAD-modell:
Ladda ned den kostnadsfria Libary Loader för att omvandla denna fil för ditt ECAD-verktyg. Läs mer om ECAD-modellen.

På lager: 198

Lager:
198 Kan skickas omedelbart
Minst: 1   Flera: 1
Enhetspris:
-,-- kr
Ext. pris:
-,-- kr
Est. Pris:

Prissättning (SEK)

Antal Enhetspris
Ext. pris
363,84 kr 363,84 kr

Produktattribut Attributvärde Välj attribut
Molex
Produktkategori: Standard kortkantskontakter
RoHS-direktivet:  
278 Position
0.8 mm
Press Fit
Vertical
Gold
170673
Märke: Molex
Kontaktmaterial: Tin
Märkström: 1.5 A
Höljets material: Thermoplastic (TP)
Maximal drifttemperatur: + 105 C
Minsta drifttemperatur: - 40 C
Förpackning: Tray
Produkttyp: Standard Card Edge Connectors
Fabriksförpackningskvantitet: 144
Underkategori: Card Edge Connectors
Handelsnamn: EdgeLine
Märkspänning: 250 VAC
Del # Alias: 1706732278 1706732278
Enhetens vikt: 11,073 g
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Attribut som valts: 0

TARIC:
8536693000
CNHTS:
8538900000
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
MXHTS:
8536699999
BRHTS:
85366990
ECCN:
EAR99

EdgeLine Connectors

Molex EdgeLine Low-Profile Connectors support up to 25Gbps data rates and are available in multiple orientations and PCB thicknesses from 1.57mm to 3.18mm for use in high-speed transmissions and high-density signal applications. The product line's one-piece solutions are cost-effective as they are only required when a peripheral interface or upgrade card is populated. EdgeLine includes a customizable card-edge interface to enable designers to specify first-mate, last-break designations as well as shorter stubs for high-speed communications. The Molex EdgeLine family delivers a low-cost, flexible, and scalable solution for low-to-mid range telecom, computing, and storage applications.

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.