2007169-1

TE Connectivity
571-2007169-1
2007169-1

Tillverk:

Beskrivning:
I/O-kontaktdon Cage 1x6 EMI Shield w/ lightpipes

ECAD-modell:
Ladda ned den kostnadsfria Libary Loader för att omvandla denna fil för ditt ECAD-verktyg. Läs mer om ECAD-modellen.

Tillgänglighet

Lager:
Ej på lager
Fabrikens ledtid:
10 Veckor Uppskattad tillverkningstid i fabriken.
Minst: 60   Flera: 60
Enhetspris:
-,-- kr
Ext. pris:
-,-- kr
Est. Pris:
Denna produkt levereras UTAN KOSTNAD

Prissättning (SEK)

Antal Enhetspris
Ext. pris
386,90 kr 23 214,00 kr
540 Beräkning

Produktattribut Attributvärde Välj attribut
TE Connectivity
Produktkategori: I/O-kontaktdon
RoHS-direktivet:  
Connectors
Female
Press Fit
Right Angle
SFP+
Bulk
Märke: TE Connectivity
Egenskaper: With lightpipe
Höljets material: Nickel
Antal portar: 6 Port
Produkttyp: I/O Connectors
Fabriksförpackningskvantitet: 12
Underkategori: I/O Connectors
Typ: SFP
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Attribut som valts: 0

Efterlevnadskoder
TARIC:
8538909999
CNHTS:
8538900000
CAHTS:
8538909090
USHTS:
8538908180
JPHTS:
853890000
BRHTS:
85389090
ECCN:
EAR99
Ursprungsklassificeringar
Ursprungsland:
Kina
Monteringsland:
Ej tillgänglig
Distributionsland:
Ej tillgänglig
Landet kan komma att ändras vid leveranstillfället.

SFP+ Enhanced Connectors

TE Connectivity SFP+ Enhanced Connectors improve thermal performance and EMI containment in applications with demanding bandwidth and data rates. The SFP+ thermal improvements provide an average 3% reduction in temperature, per port, increasing efficiency while requiring less power to operate the overall system. The new enhanced signal quality reduces EMI by approximately 10-12 dBm (within the 10-15 GHz range) due to the internal redesign of the retention and latch plates achieving better electrical connections and product strength while preventing leakage.

SFP+ Family Interconnect System

TE Connectivity SFP+ I/O Interconnects are designed to transfer data at speeds of up to 16Gb/s. The portfolio features 20-position SMT connectors as well as cages in multiple configurations, and with elastomeric gasket or enhanced EMI springs to address EMI containment at higher data rates. TE SFP+ Interconnect family also includes thermal- and EMI-enhanced stacked configurations to further improve performance. Complementary SFP+ direct-attach copper cable assemblies are also offered as high-speed, cost-effective alternatives to fiber optic cables. The assemblies enable hardware OEMs and data center operators to achieve high port density and configurability at low costs and with reduced power requirements.