SEAM-30-11.0-S-04-2-A-K-TR

Samtec
200-SEAM3011.0S042AK
SEAM-30-11.0-S-04-2-A-K-TR

Tillverk:

Beskrivning:
Kort till kort och mezzanine-anslutare .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal

ECAD-modell:
Ladda ned den kostnadsfria Libary Loader för att omvandla denna fil för ditt ECAD-verktyg. Läs mer om ECAD-modellen.

På lager: 100

Lager:
100 Kan skickas omedelbart
Fabrikens ledtid:
3 Veckor Uppskattad tillverkningstid i fabriken för kvantiteter som är större än vad som visas.
Minst: 1   Flera: 1
Enhetspris:
-,-- kr
Ext. pris:
-,-- kr
Est. Pris:

Prissättning (SEK)

Antal Enhetspris
Ext. pris
200,45 kr 200,45 kr
191,73 kr 1.917,30 kr
184,43 kr 4.610,75 kr
171,02 kr 8.551,00 kr
Komplett Papprulle (beställ i multiplar av 100)
146,93 kr 14.693,00 kr
139,30 kr 69.650,00 kr

Produktattribut Attributvärde Välj attribut
Samtec
Produktkategori: Kort till kort och mezzanine-anslutare
RoHS-direktivet:  
Headers
120 Position
1.27 mm (0.05 in)
4 Row
Solder
Vertical
16 mm, 17 mm, 17.5 mm, 18.5 mm
2.7 A
240 VAC
56 Gbps
- 55 C
+ 125 C
Gold
Copper Alloy
Liquid Crystal Polymer (LCP)
SEAM
Reel
Cut Tape
Applikation: Power, Signal
Märke: Samtec
Datahastighet: 56 Gbps
Monteringsstil: SMD/SMT
Produkttyp: Board to Board & Mezzanine Connectors
Fabriksförpackningskvantitet: 100
Underkategori: Board to Board & Mezzanine Connectors
Handelsnamn: SEARAY
Enhetens vikt: 706,190 mg
Hittade produkter:
Markera minst en kryssruta för att visa liknande produkter
Markera minst en kryssruta ovan för att visa liknande produkter i denna kategori.
Attribut som valts: 0

TARIC:
8536693000
CNHTS:
8536901100
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
MXHTS:
8536699999
BRHTS:
85366990
ECCN:
EAR99

SEARAY™ kontakter i SEAM-serien

Samtec SEARAY™ kontakter i SEAM-serien erbjuder PAM4-prestanda på 56 Gbps. Kontakterna har en .050" (1,27 mm) avståndsrutnät för maximal flexibilitet vid routing och upp till 500 I/O med singelände. Andra funktioner inkluderar de robusta Edge Rate®-kontakterna, låg kraft vid införande/uttag och tillgänglighet i staplingshöjder på 7 - 17,5 mm.

High-Density Arrays

Samtec High-Density Arrays include board-to-board mezzanine connectors and rectangular cable assemblies. These components are offered in a range of mounting angles, including horizontal, right, straight, and vertical with a wide selection of termination styles. The number of positions ranges from 100 to 560 while the number of rows ranges from 4 to 14. Samtec High-Density Arrays are available in several pitches, including 0.635mm, 0.8mm, and 1.27mm.

5G Solutions

Samtec 5G Solutions support the ultra-high frequencies and high data rates that emerging 5G technologies demand. As this 5G network quickly gains momentum, new systems, devices, and equipment are needed for technologies such as mmWave, Massive MIMO, beamforming, and full-duplex (FDX). Samtec 5G Solutions feature high-performance products for four applications: Test and Development Systems, Remote Radio and Active Antennas, Network Equipment, and Automotive and Transportation.

Flexible Stacking Connectors

Samtec Flex Stacking Board Connectors feature a large variety of board-to-board connectors with design flexibility. These Samtec board-to-board connector systems are available in a variety of pitches, densities, stack heights, orientations, and other standard or modified options, making it easy to find the right connector for any application. Flex-Stack options include one-piece, low profile pass-through, elevated, hermaphroditic, shrouded, coplanar, parallel, and perpendicular. Post heights are adjustable in increments of 0.005” (0.13mm).

5G Automotive & Transportation Solutions

Samtec 5G Automotive and Transportation Connectivity meets the needs of the growing 5G network market. As implementation of the 5G network quickly gains momentum, high-performance devices, systems, and test and measurement equipment are needed to support the ultra-high frequencies and high data rates that technologies like mmWave, Massive MIMO, beamforming, and full duplex demand. Samtec offers high-performance interconnects and high-level technical expertise to support these requirements, including an expanding portfolio of solutions ideal for Automotive applications.