SCT3017ALHRC11

ROHM Semiconductor
755-SCT3017ALHRC11
SCT3017ALHRC11

Tillverk:

Beskrivning:
SiC-MOSFET:ar 650V 118A 427W SIC 17mOhm TO-247N

ECAD-modell:
Ladda ned den kostnadsfria Libary Loader för att omvandla denna fil för ditt ECAD-verktyg. Läs mer om ECAD-modellen.

På lager: 360

Lager:
360 Kan skickas omedelbart
Fabrikens ledtid:
27 Veckor Uppskattad tillverkningstid i fabriken för kvantiteter som är större än vad som visas.
Partier som är större än 360 kommer att omfattas av ett krav på minimibeställning.
Lång ledtid har rapporterats för denna produkt.
Minst: 1   Flera: 1
Enhetspris:
-,-- kr
Ext. pris:
-,-- kr
Est. Pris:
Denna produkt levereras UTAN KOSTNAD

Prissättning (SEK)

Antal Enhetspris
Ext. pris
982,74 kr 982,74 kr

Produktattribut Attributvärde Välj attribut
ROHM Semiconductor
Produktkategori: SiC-MOSFET:ar
RoHS-direktivet:  
REACH - SVHC:
Through Hole
TO-247N-3
N-Channel
1 Channel
650 V
118 A
22.1 mOhms
- 4 V, + 22 V
5.6 V
172 nC
- 55 C
+ 175 C
427 W
Enhancement
AEC-Q101
Märke: ROHM Semiconductor
Konfiguration: Single
Falltid: 31 ns
Transkonduktans framåt - Min: 16 S
Förpackning: Tube
Produkt: MOSFET's
Produkttyp: SiC MOSFETS
Stigtid: 44 ns
Serie: SCT3x
Fabriksförpackningskvantitet: 450
Underkategori: Transistors
Teknologi: SiC
Transistortyp: 1 N-Channel
Typisk fördröjningstid vid avstängning: 64 ns
Typisk fördröjningstid vid påslagning: 30 ns
Del # Alias: SCT3017ALHR
Enhetens vikt: 6 g
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Attribut som valts: 0

                        
ROHM Semiconductors AEC-Q101 qualified products are not
intended for volume automotive production without ROHM
Semiconductors prior approval.

Please contact ROHM Semiconductor for Production Part Approval
Process (PPAP) requirements or contact a Mouser Technical Sales
Representative for further assistance.

5-0617-50

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CNHTS:
8541290000
USHTS:
8541290065
ECCN:
EAR99

SCT3x 3rd Generation SiC Trench MOSFETs

ROHM Semiconductor SCT3x series SiC Trench MOSFETs utilize a proprietary trench gate structure that reduces ON resistance by 50% and input capacitance by 35% compared with planar-type SiC MOSFETs. This design results in significantly lower switching loss and faster switching speeds, improving operational efficiency while reducing power loss in a variety of equipment. ROHM Semiconductor SCT3x includes 650V and 1200V variants for broad applicability.

Silicon Carbide (SiC) Power Devices

ROHM Semiconductor SiC Power Devices deliver 10x the dielectric breakdown field strength, 3x the bandgap, and 3x the thermal conductivity of conventional silicon solutions. This translates to lower switching loss, lower ON resistance, and support for high-temperature operation, making it possible to minimize power loss along with module size. ROHM SiC Power Devices also allow designers to use fewer components, further reducing design complexity.

AEC-Q101 SiC Power MOSFETs

ROHM Semiconductor AEC-Q101 SiC Power MOSFETs are ideal for automotive and switch-mode power supplies. The SiC Power MOSFETs can boost switching frequency, decreasing the volumes of capacitors, reactors, and other components required. AEC-Q101 SiC Power MOSFETs offer excellent reductions in size and weight within various drive systems, such as inverters and DC-DC converters in vehicles. Vehicle batteries are trending towards larger capacities with shorter charging times. This demands high power and efficiency on board chargers such as 11kW and 22kW. This leads to increased adoption of SiC MOSFETs. The AEC-Q101 SiC Power MOSFETs meet the needs of electronic vehicles and utilize a trench gate structure. The future design of ROHM's SiC MOSFETs endeavors to improve quality, strengthen its lineup to increase device performance, reduce power consumption, and achieve greater miniaturization.

N-Channel SiC Power MOSFETs

ROHM Semiconductor N-Channel Silicon Carbide (SiC) Power MOSFETs feature no tail current during switching, resulting in faster operation and reduced switching loss. Their low ON resistance and compact chip size ensure low capacitance and gate charge. These ROHM SiC Power MOSFETs exhibit minimal ON-resistance increases and provides greater package miniaturization. This provides more energy savings than standard Si devices, in which the ON-resistance can more than double with increased temperature.