170814-2008

Molex
538-170814-2008
170814-2008

Tillverk:

Beskrivning:
Kort till kort och mezzanine-anslutare NeoScale Recpt Assy 18mm 6x12

ECAD-modell:
Ladda ned den kostnadsfria Libary Loader för att omvandla denna fil för ditt ECAD-verktyg. Läs mer om ECAD-modellen.

Tillgänglighet

Lager:
Ej på lager
Minst: 288   Flera: 72
Enhetspris:
-,-- kr
Ext. pris:
-,-- kr
Est. Pris:
Denna produkt levereras UTAN KOSTNAD

Prissättning (SEK)

Antal Enhetspris
Ext. pris
577,70 kr 166.377,60 kr
504 Beräkning

Produktattribut Attributvärde Välj attribut
Molex
Produktkategori: Kort till kort och mezzanine-anslutare
RoHS-direktivet:  
Receptacles
216 Position
2.8 mm (0.11 in)
6 Row
Solder
Vertical
18 mm
1 A
30 VAC
- 55 C
+ 85 C
Gold
Copper
Liquid Crystal Polymer (LCP)
170814
Märke: Molex
Brännbarhetsklass: UL 94 V-0
Monteringsstil: SMD/SMT
Produkttyp: Board to Board & Mezzanine Connectors
Fabriksförpackningskvantitet: 72
Underkategori: Board to Board & Mezzanine Connectors
Handelsnamn: NeoScale
Del # Alias: 1708142008 01708142008
Enhetens vikt: 21,033 g
Hittade produkter:
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Attribut som valts: 0

TARIC:
8536699099
CNHTS:
8538900000
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
MXHTS:
8536699999
BRHTS:
85366990
ECCN:
EAR99

Board-to-Board Connectors

Molex Board-to-Board Connectors are available in a variety of configurations, offering an expansive array of pitches and stacking heights. The printed circuit board (PCB) is a foundational staple in the electronics industry, and with continuing trends toward miniaturization, designers need a more diverse range of solutions for creating dependable PCB connections. To fit a range of applications, Molex Board-to-Board Connectors include mezzanine, backplane, coplanar, and more. These connectors are ideal for microminiature and high-power applications.

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.

NeoScale High-Speed Mezzanine System

Molex NeoScale High-Speed Mezzanine System delivers clean signal integrity at 56Gbps. This system features a high-speed triad wafer design with patented Solder-Charge Technology for customized PCB routing in high-density system applications. Ideal for small footprint designs with limited PCB real estate, the modular NeoScale mezzanine system offers a durable and easily customizable design tool for high-density system applications. Each Molex NeoScale triad wafer is an independent element in the housing and can be customized to a design layout. With four triad wafer configurations, users can mix and match components to build a mezzanine solution to meet application requirements for signals supporting high-speed differential pairs (85Ω and 100Ω), high-speed single-ended transmissions, low-speed single-ended signals, and power contacts.