C0603X821K5RACTU

KEMET
80-C0603X821K5R
C0603X821K5RACTU

Tillverk:

Beskrivning:
Flerskiktade keramiska kondensatorer MLCC - SMD/SMT 50V 820pF 0603 X7R 10%

ECAD-modell:
Ladda ned den kostnadsfria Libary Loader för att omvandla denna fil för ditt ECAD-verktyg. Läs mer om ECAD-modellen.

Tillgänglighet

Lager:
Ej på lager
Fabrikens ledtid:
19 Veckor Uppskattad tillverkningstid i fabriken.
Minst: 1   Flera: 1
Enhetspris:
-,-- kr
Ext. pris:
-,-- kr
Est. Pris:
Förpackning:
Komplett Papprulle (beställ i multiplar av 4000)

Prissättning (SEK)

Antal Enhetspris
Ext. pris
Skärtejp/MouseReel™
2,73 kr 2,73 kr
1,89 kr 18,90 kr
1,34 kr 134,00 kr
1,16 kr 580,00 kr
1,08 kr 1 080,00 kr
1,03 kr 2 060,00 kr
Komplett Papprulle (beställ i multiplar av 4000)
0,88 kr 3 520,00 kr
0,848 kr 6 784,00 kr
† 58,00 kr MouseReel™-avgiften kommer att läggas till och beräknas i din kundvagn. MouseReel™-beställningar kan inte avbeställas eller returneras.

Liknande produkter

Produktattribut Attributvärde Välj attribut
KEMET
Produktkategori: Flerskiktade keramiska kondensatorer MLCC - SMD/SMT
RoHS-direktivet:  
820 pF
50 VDC
X7R
10 %
0603
1608
SMD/SMT
Flexible (Soft)
- 55 C
+ 125 C
1.6 mm (0.063 in)
0.8 mm (0.031 in)
0.8 mm (0.031 in)
General Type MLCCs
SMD Comm X7R Flex
Reel
Cut Tape
MouseReel
Märke: KEMET
Klass: Class 2
Paket/låda: 0603 (1608 metric)
Produkttyp: Ceramic Capacitors
Fabriksförpackningskvantitet: 4000
Underkategori: Capacitors
Handelsnamn: FT-CAP
Typ: Surface Mount Multilayer Ceramic Chip Capacitor
Del # Alias: C0603X821K5RAC7867
Enhetens vikt: 6,300 mg
Hittade produkter:
Markera minst en kryssruta för att visa liknande produkter
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Attribut som valts: 0

Efterlevnadskoder
TARIC:
8532240000
CNHTS:
8532241000
CAHTS:
8532240010
USHTS:
8532240020
JPHTS:
853224000
KRHTS:
8532400000
BRHTS:
85322410
ECCN:
EAR99
Ursprungsklassificeringar
Ursprungsland:
Mexiko
Monteringsland:
Ej tillgänglig
Distributionsland:
Ej tillgänglig
Landet kan komma att ändras vid leveranstillfället.

Group Power Conversion Components

YAGEO Group (YAGEO, Pulse, KEMET) designs passive component technologies that are critical in power conversion systems, including safety, snubber, and DC link capacitors; current sense and power resistors; and magnetic components such as transformers, common mode chokes, and inductors. Because every electronic device requires power, a vast majority of these products utilize a form of power conversion or power supply to deliver the required energy. 

Flexible Termination MLCCs

KEMET Flexible Termination technology is utilized in several series of surface-mount Multilayer Ceramic Chip Capacitors (MLCCs). These capacitors were developed to address flex cracks, the industry's primary failure mode for MLCCs. The Flexible termination directs circuit board stress away from the ceramic body and into the termination area. These MLCCs reduce the risk of mechanical damage to the component that can result in low IR and short circuit failures.

Flexible Mitigation Surface Mount ≤250V MLCCs

KEMET Flexible Mitigation Surface Mount ≤250V MLCCs are solutions designed to reduce the risk of flex cracks. These solutions include the following: Flexible Termination (FT-CAP), Floating Electrode (FE-CAP), and Open Mode (FO-CAP) Technology. 

High CV Multilayer Ceramic Capacitors (MLCCs)

KEMET High CV Multilayer Ceramic Capacitors (MLCCs) are a preferred capacitance solution, offering tremendous performance, reliability, and cost advantages for circuit designers. Ceramics are non-polar devices that offer unsurpassed volumetric efficiency, delivering high capacitance in small package sizes. Available in a wide range of sizes, KEMET High CV MLCCs offer very low equivalent series resistance (ESR), exhibit excellent high-frequency characteristics, and are very reliable. MLCCs are monolithic devices that consist of laminated layers of specially formulated ceramic dielectric materials interspersed with a metal electrode system. The layered formation is then fired at a high temperature to produce a sintered and volumetrically efficient capacitance device. A conductive termination barrier system is integrated into the exposed ends of the chip to complete the connection.