ATS025025009-PF015

Advanced Thermal Solutions
984-AT025025009PF015
ATS025025009-PF015

Tillverk:

Beskrivning:
Kylflänsar BGA Heat Sink, Pin Fin, No TIM, Black Anodized, 25x25x8.9mm (LxWxH)

ECAD-modell:
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Tillgänglighet

Lager:
780 Kan skickas om 20 dagar
Minst: 1   Flera: 1
Enhetspris:
-,-- kr
Ext. pris:
-,-- kr
Est. Pris:

Prissättning (SEK)

Antal Enhetspris
Ext. pris
31,27 kr 31,27 kr
27,88 kr 278,80 kr
26,61 kr 532,20 kr
25,65 kr 1 282,50 kr
24,59 kr 2 459,00 kr
23,21 kr 4 642,00 kr
22,58 kr 11 290,00 kr
21,84 kr 21 840,00 kr

Produktattribut Attributvärde Välj attribut
Advanced Thermal Solutions
Produktkategori: Kylflänsar
RoHS-direktivet:  
Heat Sinks
BGA
PCB
Aluminum
Omnidirectional Fin
13.5 C/W
25 mm
25 mm
8.9 mm
Märke: Advanced Thermal Solutions
Färg: Black
Förpackning: Bulk
Produkttyp: Heat Sinks
Serie: BGA High Aspect Ratio
Fabriksförpackningskvantitet: 100
Underkategori: Heat Sinks
Handelsnamn: Value-Line Platform
Typ: Component
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Efterlevnadskoder
USHTS:
7616995100
ECCN:
EAR99
Ursprungsklassificeringar
Ursprungsland:
Kina
Monteringsland:
Ej tillgänglig
Distributionsland:
Ej tillgänglig
Landet kan komma att ändras vid leveranstillfället.

Pin Fin Value-Line Heat Sinks

Advanced Thermal Solutions Pin Fin Value-Line Heat Sinks are engineered with thin and dense fields of pin-shaped cooling fins. These heat sinks are fabricated from extruded aluminum to minimize thermal resistance from the base to the fins. This process reduces weight and keeps the cost low. These heat sinks are available for component sizes 10mm x 10mm to 60mm x 60mm, and height ranges from 2mm to 25mm with 1mm increments. The pin fin heat sinks feature large surface areas that increase heat sink performance and provide high-efficiency and low-pressure drop characteristics. These heat sinks can be attached to the devices with double-sided thermal adhesive, Z-clip, or maxiGRIP™ technologies. The custom pin fin design offers an excellent cooling solution for spatially constrained PCB layouts when the airflow direction near the device is ambiguous.

BGA - High Aspect Ratio Value-Line Heat Sinks

Advanced Thermal Solutions BGA - High Aspect Ratio Value-Line Heat Sinks are offered in pin fin, straight fin, and slant fin profiles. These high-performance heat sinks ensure reliable product life at a lower cost than other extruded heat sinks. The high aspect ratio value-line heat sinks come in industry-standard footprints ranging from 10mm x 10mm to 60mm x 60mm. The extruded aluminum minimizes thermal resistance, reduces weight, and keeps costs low. The Slant fin heat sinks feature a low-profile, slant fin array that offers many benefits of maxiFLOW™ at a great value.