ATS017017007-PF-5F

Advanced Thermal Solutions
984-ATS017017007PF5F
ATS017017007-PF-5F

Tillverk:

Beskrivning:
Kylflänsar BGA Heat Sink, High Aspect Ratio Extrusion, Custom Pin Fin, 17x17x7mm

ECAD-modell:
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På lager: 23

Lager:
23 Kan skickas omedelbart
Fabrikens ledtid:
20 Veckor Uppskattad tillverkningstid i fabriken för kvantiteter som är större än vad som visas.
Minst: 1   Flera: 1
Enhetspris:
-,-- kr
Ext. pris:
-,-- kr
Est. Pris:

Prissättning (SEK)

Antal Enhetspris
Ext. pris
151,58 kr 151,58 kr
141,93 kr 1 419,30 kr
133,56 kr 2 671,20 kr
125,29 kr 6 264,50 kr
118,72 kr 11 872,00 kr
111,94 kr 22 388,00 kr
108,97 kr 54 485,00 kr

Produktattribut Attributvärde Välj attribut
Advanced Thermal Solutions
Produktkategori: Kylflänsar
RoHS-direktivet:  
Heat Sinks
BGA
Adhesive
Aluminum
Pin Fin
24.66 C/W
17 mm
17 mm
7 mm
Märke: Advanced Thermal Solutions
Färg: Black
Monteringsland: Not Available
Distributionsland: Not Available
Ursprungsland: US
Produkttyp: Heat Sinks
Serie: BGA High Aspect Ratio
Fabriksförpackningskvantitet: 100
Underkategori: Heat Sinks
Handelsnamn: Value-Line Platform
Typ: Component
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TARIC:
8542900000
CNHTS:
7616991090
CAHTS:
8542900000
USHTS:
8542900000
JPHTS:
854290000
MXHTS:
8542900100
ECCN:
EAR99

Pin Fin Value-Line Heat Sinks

Advanced Thermal Solutions Pin Fin Value-Line Heat Sinks are engineered with thin and dense fields of pin-shaped cooling fins. These heat sinks are fabricated from extruded aluminum to minimize thermal resistance from the base to the fins. This process reduces weight and keeps the cost low. These heat sinks are available for component sizes 10mm x 10mm to 60mm x 60mm, and height ranges from 2mm to 25mm with 1mm increments. The pin fin heat sinks feature large surface areas that increase heat sink performance and provide high-efficiency and low-pressure drop characteristics. These heat sinks can be attached to the devices with double-sided thermal adhesive, Z-clip, or maxiGRIP™ technologies. The custom pin fin design offers an excellent cooling solution for spatially constrained PCB layouts when the airflow direction near the device is ambiguous.

BGA - High Aspect Ratio Value-Line Heat Sinks

Advanced Thermal Solutions BGA - High Aspect Ratio Value-Line Heat Sinks are offered in pin fin, straight fin, and slant fin profiles. These high-performance heat sinks ensure reliable product life at a lower cost than other extruded heat sinks. The high aspect ratio value-line heat sinks come in industry-standard footprints ranging from 10mm x 10mm to 60mm x 60mm. The extruded aluminum minimizes thermal resistance, reduces weight, and keeps costs low. The Slant fin heat sinks feature a low-profile, slant fin array that offers many benefits of maxiFLOW™ at a great value.