FF600R12ME4CBOSA1
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Se produktspecifikationer
Se produktspecifikationer
726-FF600R12ME4CBOSA
FF600R12ME4CBOSA1
Tillverk:
Beskrivning:
IGBT-moduler 1200 V, 600 A dual IGBT module
IGBT-moduler 1200 V, 600 A dual IGBT module
Livscykel:
NRND:
Rekommenderas ej för ny design.
Datablad:
Tillgänglighet
-
Lager:
-
0
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Fabrikens ledtid:
-
22 Veckor Uppskattad tillverkningstid i fabriken.
Denna produkt levereras UTAN KOSTNAD
Prissättning (SEK)
| Antal | Enhetspris |
Ext. pris
|
|---|---|---|
| 2 117,46 kr | 2 117,46 kr |
Datablad
Application Notes
- Application Note IGBT Definition of Junction Temperature (PDF)
- Driving IGBTs with unipolar gate voltage (PDF)
- Evaluation Board for 2ED300C17 -S/ -ST (AN2007-05) (PDF)
- Evaluation Driver Board for EconoDUAL ME3, ME4 and EconoPACK+ modules (PDF)
- Industrial IGBT Modules Explanation of Technical Information (PDF)
- Module Adapter Board for EconoDUAL™3 IGBT Modules (PDF)
- Mounting instructions EconoDUAL™ 3 Modules (PDF)
- Soldering of Econo and Easy Modules (PDF)
- Transient Thermal Measurements and thermal equivalent circuit models (PDF)
- Using the NTC inside a power module (PDF)
Product Catalogs
- EconoDUAL™, EconoPACK™ 4 and EconoPACK™ + Power Modules (PDF)
- Gate Driver Selection Guide 2019 (PDF)
- Infineon's Latest Power and Sensing Guide (PDF)
- Selection Guide (PDF)
- Solutions for Industrial Drives (PDF)
- Solutions for Traction Systems (PDF)
- Solutions for Uninterruptible Power Supply (UPS) Systems (PDF)
Technical Resources
- „Econo“ my improvement in inverter-converter-moduldesign (PDF)
- 1200V IGBT4 -High Power- a new Technology Generation with Optimized Characteristics for High Current Modules (PDF)
- Comparison between active and passive thermal cycling stress with respect to substrate solder reliability in IGBT modules with Cu baseplates (PDF)
- Correlating NTC-Reading and Chip-Temperature in Power Electronic Modules (PDF)
- FPGA to Control Power Electronics (PDF)
- Gehirn trifft Muskel: FPGA steuert Leistungshalbleiter an - Article in Elektronikpraxis 05.2014 (PDF)
- IGBT Module technology state of the art and future evolutions (PDF)
- Improving Efficiency in AC drives: Comparison of Topologies and Device Technologies (PDF)
- New superior assembly technologies for modules with highest power densities (PDF)
- On the loss - softness trade-off: Are different chip versions needed for softness-improvement? (PDF)
- Saving money: SiC in UPS applications (PDF)
- The challenge of accurately analyzing thermal resistances (PDF)
Efterlevnadskoder
- TARIC:
- 8541290000
- CNHTS:
- 8541290000
- CAHTS:
- 8541290000
- USHTS:
- 8541290065
- JPHTS:
- 8541290100
- MXHTS:
- 85412999
- ECCN:
- EAR99
Ursprungsklassificeringar
- Ursprungsland:
- Ungern
- Monteringsland:
- Ungern
- Distributionsland:
- Ej tillgänglig
